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ADM3491AR-ADM3491AR.-ADM3491ARU
3.3 V, Full Duplex, 840 uA 20 Mbps, EIA RS-485 Transceiver
REV.0
3.3 V, Full Duplex, 840 mA
20 Mbps, EIA RS-485 Transceiver
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Operates with +3.3 V Supply
EIA RS-422 and RS-485 Compliant Over Full CM Range
19 kV Input Impedance
Up to 50 Transceivers on Bus
20 Mbps Data Rate
Short Circuit Protection
Specified Over Full Temperature Range
Thermal Shutdown
Interoperable with 5 V Logic
840 mA Supply Current
2 nA Shutdown Current
Also Available in TSSOP Package
Meets IEC1000-4-4 (>1 kV)
8 ns Skew
Upgrade for MAX 3491, SN75ALS180
APPLICATIONS
Telecommunications
DTE-DCE Interface
Packet Switching
Local Area Networks
Data Concentration
Data Multiplexers
Integrated Services Digital Network (ISDN)
AppleTalk
Industrial Controls
GENERAL DESCRIPTIONThe ADM3491 is a low power differential line transceiver
designed to operate using a single +3.3 V power supply. Low
power consumption coupled with a shutdown mode make it
ideal for power sensitive applications. It is suitable for commu-
nication on multipoint bus transmission lines.
It is intended for balanced data transmission and complies with
both EIA Standards RS-485 and RS-422. It contains a differen-
tial line driver and a differential line receiver, making it suitable
for full duplex data transfer.
The input impedance is 19 kΩ allowing up to 50 transceivers to
be connected on the bus.
Excessive power dissipation caused by bus contention or by
output shorting is prevented by a thermal shutdown circuit.
This feature forces the driver output into a high impedance state
if, during fault conditions, a significant temperature increase is
detected in the internal driver circuitry.
The receiver contains a fail-safe feature that results in a
logic high output state if the inputs are unconnected
(floating).
The ADM3491 is fabricated on BiCMOS, an advanced
mixed technology process combining low power CMOS
with fast switching bipolar technology.
The ADM3491 is fully specified over the industrial tem-
perature range and is available in DIP and SOIC packages
as well as a new space saving TSSOP package.
ADM3491–SPECIFICATIONS(VCC = +3.3 V 6 0.3 V. All specifications TMIN to TMAX unless otherwise noted.)RECEIVER
Specifications subject to change without notice.
TIMING SPECIFICATIONS
(VCC = +3.3 V, TA = +258C)
TIMING SPECIFICATIONS
(VCC = +3.3 V 6 0.3 V, TA = TMIN to TMAX)
ADM3491
ORDERING GUIDE
ABSOLUTE MAXIMUM RATINGS*(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7 V
Inputs
Driver Input (DI) . . . . . . . . . . . . . . . .–0.3 V to VCC + 0.3 V
Control Inputs (DE, RE) . . . . . . . . . .–0.3 V to VCC + 0.3 V
Receiver Inputs (A, B) . . . . . . . . . . . . . . .–7.5 V to +12.5 V
Outputs
Driver Outputs . . . . . . . . . . . . . . . . . . . . .–7.5 V to +12.5 V
Receiver Output . . . . . . . . . . . . . . . . .–0.5 V to VCC +0.5 V
Power Dissipation 14-Lead DIP . . . . . . . . . . . . . . . .800 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . .140°C/W
Power Dissipation 14-Lead SOIC . . . . . . . . . . . . . . .650 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . .115°C/W
Power Dissipation 16-Lead TSSOP . . . . . . . . . . . . . .500 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . .158 °C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . .+300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . ..+220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2 kV
EFT Rating (IEC1000-4-4) . . . . . . . . . . . . . . . . . . . . . .>1 kV
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum
ratings for extended periods of time may affect device reliability.
PIN CONFIGURATION
DIP/SOIC
GND
GND
VCC
VCC
NC = NO CONNECT
TSSOP
VCC
GND
NC = NO CONNECT
PIN FUNCTION DESCRIPTIONSADM3491
Test Circuits
VCC
R/2
R/2VOCFigure 1.Driver Voltage Measurement Test Circuit
0V OR 3V
DE INS1
VOUT
VCCFigure 2.Driver Enable/Disable Test Circuit
Figure 3.Driver Differential Output Delay Test Circuit
Figure 4.Driver/Receiver Propagation Delay Test Circuit
375V
375VFigure 5.Driver Voltage Measurement Test Circuit 2
+1.5V
–1.5V
RE INCL
VOUT
VCCRLFigure 6.Receiver Enable/Disable Test Circuit
S1
VCC
VOUT
VOMFigure 7.Driver Propagation Delay Test Circuit
VID
+1.5VCLVOUTFigure 8.Receiver Propagation Delay Test Circuit
