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ADM3101E
卤15 kV ESD Protected, 3.3 V Single-Channel RS-232 Line Driver/Receiver
±15 kV ESD Protected, 3.3 V Single-Channel
RS-232 Line Driver/ReceiverADM3101E
FEATURES
460 kbps data rate
1 Tx and 1 Rx
Meets EIA/TIA-232E specifications
0.1 μF charge pump capacitors
Contact discharge: ±8 kV
Air gap discharge: ±15 kV
APPLICATIONS
General-purpose RS-232 data links
Industrial/telecommunications diagnostics ports
FUNCTIONAL BLOCK DIAGRAM +0.1µF16V0.1µF16V
CMOSINPUT
CMOSOUTPUT0.1µFC30.1µF6.3V0.1µF16V
EIA/TIA-232EOUTPUT
EIA/TIA-232EINPUT*
*INTERNAL 5kΩ PULL-DOWN RESISTOR ON THE RS-232 INPUT.Figure 1.
GENERAL DESCRIPTION The ADM3101E is a high speed, single-channel, RS-232/
ITU-T V.28 transceiver interface device that operates from
a single 3.3 V power supply. Low power consumption makes
it ideal for battery-powered portable instruments.
The ADM3101E conforms to the EIA/TIA-232E and ITU-T V.28
specifications and operates at data rates of up to 460 kbps.
All RS-232 (TOUT and RIN) and CMOS (TIN and ROUT) inputs
and outputs are protected against electrostatic discharges (up
to ±15 kV ESD protection).
Because of the ±15 kV ESD protection of the ADM3101E
input/output pins, this device is ideally suited for operation
in electrically harsh environments or where RS-232 cables are
frequently plugged and unplugged.
Four external 0.1 μF charge pump capacitors are used for the
voltage doubler/inverter permitting operation from a single
3.3 V supply.
The ADM3101E is available in both a 12-lead LFCSP and 16-lead
QSOP, specified over the −40°C to +85°C temperature range.
TABLE OF CONTENTS Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
ESD Caution .................................................................................. 4
Pin Configurations and Function Descriptions ............................5
Typical Performance Characteristics ..............................................6
Theory of Operation .........................................................................8
Circuit Description .......................................................................8
High Baud Rate ..............................................................................8
Outline Dimensions ..........................................................................9
Ordering Guide .............................................................................9
REVISION HISTORY
7/08—Rev. B to Rev. C Changes to General Description Section ...................................... 1
Reformatted Table 1 ......................................................................... 4
Change to TIN Rating, Table 2 ......................................................... 4
Changes to Figure 2 .......................................................................... 5
Moved High Baud Rate Section ...................................................... 8
Added Exposed Pad Notation to Outline Dimensions ............... 9
12/07—Rev. A to Rev. B Added 16-lead QSOP Package (Universal) ................................... 1
Updated Outline Dimensions ....................................................... 10
Changes to Ordering Guide .......................................................... 10
10/07—Rev. 0 to Rev. A Changes to Figure 1 ........................................................................... 1
Changes to Table 1, RS-232 Receiver Section ................................ 3
Changes to Table 3 ............................................................................. 5
Changes to Figure 11 ......................................................................... 8
5/07—Revision 0: Initial Version ADM3101ESPECIFICATIONS VCC = 3.3 V ± 0.3 V, C1 to C4 = 0.1 μF, −40°C ≤ TA ≤ +85°C, unless otherwise noted.
Table 1. Guaranteed by design.
ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted.
Table 2. Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION ADM3101EPIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS -00
C1+ROUTTIN
9RIN
8TOUT
7V–
PIN 1INDICATOR
ADM3101E
TOP VIEW(Not to Scale)
NOTES1.PADDLE CONNECTED TO GND. THIS CONNECTION IS NOTREQUIRED TO MEET THE ELECTRICAL PERFORMANCES. Figure 2. LFCSP Pin Configuration
NC = NO CONNECT
C1+
ROUT
TIN
C1–
VCC
C2–
RIN
GND
TOUT
C2+
TOP VIEW(Not to Scale)
ADM3101EFigure 3. QSOP Pin Configuration
Table 3. Pin Function Descriptions Description Positive and Negative Connections for Charge Pump Capacitor. External Capacitor C1 is connected
between these pins; a 0.1 μF capacitor is recommended, but larger capacitors up to 10 μF can be used. Receiver Output. This pin outputs CMOS output logic levels. Transmitter (Driver) Input. This input accepts TTL/CMOS levels. Internally Generated Positive Supply (+6 V Nominal). Power Supply Input, 3.0 V to 5.5 V. Ground. Must be connected to 0 V. Internally Generated Negative Supply (−6 V Nominal). Transmitter (Driver) Output. This pin outputs RS-232 signal levels (typically ±6 V). Receiver Input. This input accepts RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is
connected on the input. Positive and Negative Connections for Charge Pump Capacitor. External Capacitor C2 is connected
between these pins; a 0.1 μF capacitor is recommended, but larger capacitors up to 10 μF can be used. No Connect. These pins should always remain unconnected.
TYPICAL PERFORMANCE CHARACTERISTICS 1000
LOAD CAPACITANCE (pF)
OU
(V
200400600800Figure 4. Transmitter Output Voltage High/Low vs.
Load Capacitance @ 460 kbps
VCC (V)
OU
(V
–10Figure 5. Transmitter Output Voltage High/Low vs. VCC, RL = 3 kΩ
0
LOAD CURRENT (mA)
OU
(V34Figure 6. Transmitter Output Voltage High/Low vs. Load Current
LOAD CURRENT (mA)2413Figure 7. Charge Pump V+, V− vs. Load Current
VCC (V)
ARG
IM
DANCE300
100Figure 8. Charge Pump Impedance vs. VCC
01000
LOAD CAPACITANCE (pF)
(m
200400600800Figure 9. Power Supply Current vs. Load Capacitance
