ADM208AN ,0.1 uF, +5 V Powered CMOS RS-232 Drivers/ReceiversSpecifications T to T unless otherwise noted.)MIN MAXParameter Min Typ Max Units Test Conditions/Co ..
ADM208AR ,0.1 uF, +5 V Powered CMOS RS-232 Drivers/ReceiversSPECIFICATIONS211, 213); V = +5 V 6 5% (ADM205);CCV+ = +9 V to +13.2 V (ADM209); C1–C4 = 0.1 mF Cer ..
ADM208AR ,0.1 uF, +5 V Powered CMOS RS-232 Drivers/ReceiversGENERAL DESCRIPTION active-high receiver enable control. Two receivers of theThe ADM2xx family of l ..
ADM208AR ,0.1 uF, +5 V Powered CMOS RS-232 Drivers/ReceiversSpecifications T to T unless otherwise noted.)MIN MAXParameter Min Typ Max Units Test Conditions/Co ..
ADM208AR-REEL , 0.1 muF, 5 V Powered CMOS RS-232 Drivers/Receivers
ADM208ARS ,0.1 uF, +5 V Powered CMOS RS-232 Drivers/ReceiversSPECIFICATIONS211, 213); V = +5 V 6 5% (ADM205);CCV+ = +9 V to +13.2 V (ADM209); C1–C4 = 0.1 mF Cer ..
AHC373 , OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS
AHC573 , OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS
AHC573 , OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS
AHC74 , DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET
AHC74 , DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR AND PRESET
AHCT244 , OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
ADM205AN-ADM206AN-ADM206AR-ADM206ARS-ADM207AN-ADM207AR-ADM207ARS-ADM208AN-ADM208AR-ADM208ARS-ADM209AN-ADM209AR-ADM211AR-ADM211ARS-ADM213AR-ADM213ARS
0.1 uF, +5 V Powered CMOS RS-232 Drivers/Receivers
TYPICAL OPERATING CIRCUITREV.0
0.1 mF, +5 V Powered
CMOS RS-232 Drivers/Receivers
FEATURES
0.1 mF to 10 mF Capacitors
120 kB/s Data Rate
2 Receivers Active in Shutdown (ADM213)
On-Board DC-DC Converters69 V Output Swing with +5 V Supply
Low Power (15 mW)
Low Power Shutdown ≤5 mW630 V Receiver Input Levels
Latch-Up FREE
Plug-In Upgrade for MAX205-211/213
APPLICATIONS
Computers
Peripherals
Modems
Printers
Instruments
GENERAL DESCRIPTIONThe ADM2xx family of line drivers/receivers is intended for all
EIA-232-E and V.28 communications interfaces, especially in
applications where ±12 V is not available. The ADM205,
ADM206, ADM211 and ADM213 feature a low power shut-
down mode which reduces power dissipation to less than 5 μW
making them ideally suited for battery powered equipment. The
ADM205 does not require any external components and is par-
ticularly useful in applications where printed circuit board space
is critical. The ADM213 has an active-low shutdown and an
active-high receiver enable control. Two receivers of the
ADM213 remain active during shutdown. This feature is useful
for ring indicator monitoring.
All members of the ADM2xx family, except the ADM209, in-
clude two internal charge pump voltage converters which allow
operation from a single +5 V supply. These converters convert
the +5 V input power to the ±10 V required for RS-232 output
levels. The ADM209 is designed to operate from +5 V and
+12 V supplies. An internal +12 V to –12 V charge pump volt-
age converter generates the –12 V supply.
Table I. Selection Table
ADM205–ADM211/ADM213–SPECIFICATIONSV+ Power Supply Current
Shutdown Supply Current
Input Logic Threshold Low, VINL
Input Logic Threshold High, VINH
Logic Pull-Up Current
RS-232 Input Voltage Range
RS-232 Input Threshold Low
RS-232 Input Threshold High
RS-232 Input Hysteresis
RS-232 Input Resistance
TTL/CMOS Output Voltage Low, VOL
TTL/CMOS Output Voltage High, VOH
TTL/CMOS Output Leakage Current
Output Disable Time (TDIS)
Propagation Delay
Instantaneous Slew Rate
NOTESample tested to ensure compliance.
Specifications subject to change without notice.
(VCC = +5 V 6 10% (206, 207, 208, 2O9,
211, 213); VCC = +5 V 6 5% (ADM205);
V+ = +9 V to +13.2 V (ADM209); C1–C4 = 0.1 mF Ceramic. All Specifications TMIN to TMAX unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS*(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . .(VCC – 0.3 V) to +14 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –14 V
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to (VCC + 0.3 V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±30 V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . .(V+, + 0.3 V) to (V–, –0.3 V)
ROUT . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to (VCC + 0.3 V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Power Dissipation
N-24 DIP (Derate 13.5 mW/°C above +70°C) . . .1000 mW
N-24A DIP (Derate 13.5 mW/°C above +70°C) . .500 mW
R-24 SOIC (Derate 12 mW/°C above +70°C) . . . . .850 mW
R-28 SOIC (Derate 12.5 mW/°C above +70°C) . .900 mW
RS-28 SSOP (Derate 10 mW/°C above +70°C) . . . .900 mW
Q-24 Cerdip (Derate 12.5 mW/°C above +70°C) .1000 mW
D-24 Ceramic (Derate 20 mW/°C above +70°C) . .1000 mW
Thermal Impedance, θJA
N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120°C/W
N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110°C/W
R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85°C/W
R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80°C/W
RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100°C/W
Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105°C/W
Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100°C/W
Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100°C/W
Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55°C/W
D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50°C/W
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . .-40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . .+300°C
Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .> 2000 V
*This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operation sections of this specifica-
tion is not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.
ORDERING GUIDE
ADM208ADM208AN
ADM208AR
*N = Plastic DIP; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP).
Figure 1.ADM205 DIP Pin Configuration
ADM205–ADM211/ADM213Figure 3.ADM206 DIP/SOIC/SSOP Pin Configuration
Figure 4.ADM206 Typical Operating Circuit
Figure 5.ADM207 DIP/SOIC/SSOP Pin Configuration
Figure 9.ADM209 DIP/SOIC/SSOP Pin Configuration
Figure 10.
Figure 7.ADM208 DIP/SOIC/SSOP Pin Configuration
Figure 8.ADM208 Typical Operating Circuit
ADM205–ADM211/ADM213Figure 11.ADM211 SOIC/SSOP Pin Configuration
Figure 12.ADM211 Typical Operating Circuit
Figure 13.
