ADM1232AN-ADM1232ARM-ADM1232ARN-ADM1232ARW Fast Delivery |IC PHOENIX CO.,LIMITED

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ADM1232AN-ADM1232ARM-ADM1232ARN-ADM1232ARW
Microprocessor Supervisory Circuit
REV.B
Microprocessor
Supervisory Circuit
FUNCTIONAL BLOCK DIAGRAM
GND
PB RESET
TOLERANCE
VCC
FEATURES
Superior Upgrade for MAX1232 and Dallas DS1232
Low Power Consumption (500 mA max)
Adjustable Precision Voltage Monitor with +4.5 V and
+4.75 V Options
Adjustable STROBE Monitor with 150 ms, 600 ms or
1.2 sec Options
No External Components
APPLICATIONS
Microprocessor Systems
Portable Equipment
Computers
Controllers
Intelligent Instruments
Automotive Systems
Protection Against Damage Caused by mP Failure
GENERAL DESCRIPTION
The ADM1232 is a superior, pin-compatible upgrade for the
MAX1232 and the DS1232LP and DS1232. The Analog
Devices ADM1232 is a microprocessor monitoring circuit that
can monitor:Microprocessor Supply Voltage.Whether a Microprocessor has locked-up.An External Interrupt.
The ADM1232 is available in four different packages:The ADM1232ARM in an 8-lead microSOIC (RM-8).The ADM1232AN in an 8-lead PDIP (N-8).The ADM1232ARW in a 16-lead wide SOIC (R-16).The ADM1232ARN is an 8-lead narrow SOIC (R-8).
+5V+5V
Figure 1.Typical Supply Monitoring Application
ADM1232–SPECIFICATIONS(VCC = Full Operating Range, TA = TMIN to TMAX unless otherwise noted)
Specifications subject to change without notice.
ORDERING GUIDE
*N= Plastic DIP; R = Small Outline; RM = microSOIC.
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+5.5 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . .–0.3 V to VCC + 0.3 V
Storage Temperature Range . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . .+300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
N-8
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Derate by 13.5 mW/°C above 25°C
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .100°C/W
R-16
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . .900 mW
Derate by 12 mW/°C above 25°C
θJA Thermal Impedance (Still Air) . . . . . . . . . . . . . .73°C/W
RM-8
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . .900 mW
Derate by 12 mW/°C above 25°C
θJA Thermal Impedance (Still Air) . . . . . . . . . . . . .206°C/W
R-8
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . .900 μW
Derate by 12 mW/°C above 25°C
θJA Thermal Impedance (Still Air) . . . . . . . . . . . . .153°C/W
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum ratings
for extended periods of time may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADM1232 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ADM1232
PIN FUNCTION DESCRIPTIONS
PIN CONFIGURATIONS
R-16N-8 and R-8RM-8
NC = NO CONNECT
STROBENC
TOLERANCE
GND
PB RESET
RESET
RESET
VCC
PB RESET
RESET
STROBE
VCC
TOLERANCE
GND
RESET
PB RESET
RESET
STROBE
VCC
TOLERANCE
GND
RESET
STROBE Timeout Selection
TD or time delay set is used to set the Strobe Timeout Period.
The Strobe Timeout Period is defined as being the maximum
time between high-to-low transitions (Figure 4) that STROBE
will accept before a reset will be asserted. The Strobe timeout
settings are listed in Table I.
Table I.
STROBE TIMEOUT PERIOD
STROBE
STROBE
PULSE WIDTH
Figure 4.STROBE Parameters
VCC
RESET
+5V
RESET
RESET OUTPUT DELAY
WHEN IS VCCFALLING
+5V
Figure 5.Reset Output Delay
TOLERANCE
The TOLERANCE input is used to determine the level VCC can
vary below 5 V without the ADM1232 asserting a reset. Con-
necting TOLERANCE to ground will select a –5% tolerance
level and will cause the ADM1232 to generate a reset if VCC
falls below 4.75 V (typical). If TOLERANCE is connected to
VCC a –10% tolerance level is selected and will cause the
ADM1232 to generate a reset if VCC falls below 4.5 V (typical).
Check the parameters for the VCC trip point in the ADM1232
Specifications for more information.
RESET AND RESET OUTPUTS
While RESET is capable of sourcing and sinking current,RESET is an open drain MOSFET which sinks current only.
Therefore, it is necessary to pull this output high.
CIRCUIT INFORMATION
PB RESET
The PB RESET input makes it possible to manually reset a system
using either a standard push-button switch or a logic low
input. An internal debounce circuit provides glitch immunity
when used with a switch, reducing the effects of glitches on the
line. The debounce circuit is guaranteed to cause the ADM1232
to assert a reset if PB RESET is brought low for more than 20 ms
and is guaranteed to ignore low inputs of less than 1 ms.
VCC
Figure 2.Typical Push Button Reset Application
RESET
RESET
PB RESET
RESET ACTIVE
Figure 3.PB RESET
C3053b–1–12/97
PRINTED IN U.S.A.
ADM1232
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
16-Lead Wide SOIC
(R-16)
0.4133 (10.50)
0.3977 (10.00)
0.4193 (10.65)0.3937 (10.00)0.2914 (7.40)
PIN 1
SEATING
PLANE
0.0118 (0.30)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.1043 (2.65)
0.0926 (2.35)
(1.27)
BSC
0.0125 (0.32)
0.0091 (0.23)
0.0500 (1.27)
0.0157 (0.40)
0.0291 (0.74)
0.0098 (0.25)x 45°
8-Lead microSOIC
(RM-8)51
0.122 (3.10)
0.114 (2.90)
0.199 (5.05)
0.187 (4.75)
PIN 1
0.0256 (0.65) BSC
0.122 (3.10)
0.114 (2.90)
SEATING
PLANE
0.006 (0.15)
0.002 (0.05)
0.018 (0.46)
0.008 (0.20)
0.043 (1.09)
0.037 (0.94)
0.120 (3.05)
0.112 (2.84)
0.011 (0.28)
0.003 (0.08)
0.028 (0.71)
0.016 (0.41)
33°
27°
0.120 (3.05)
0.112 (2.84)
8-Lead PDIP
(N-8)
PIN 1
SEATING
PLANE0.022 (0.558)
0.014 (0.356)
0.060 (1.52)
0.015 (0.38)0.210 (5.33)
MAX0.130
(3.30)
MIN
0.070 (1.77)
0.045 (1.15)
(2.54)
BSC
0.160 (4.06)
0.115 (2.93)
0.325 (8.25)
0.300 (7.62)
0.015 (0.381)
0.008 (0.204)
0.195 (4.95)
0.115 (2.93)
8-Lead Narrow SOIC
(R-8)
0.1574 (4.00)
0.1497 (3.80)
0.2440 (6.20)
0.2284 (5.80)
PIN 1
SEATING
PLANE
0.0098 (0.25)
0.0040 (0.10)
0.0192 (0.49)
0.0138 (0.35)
0.102 (2.59)
0.094 (2.39)
(1.27)
BSC
0.0098 (0.25)
0.0075 (0.19)
0.0500 (1.27)
0.0160 (0.41)
0.0196 (0.50)
0.0099 (0.25)x 45°

Partno	Mfg	Dc	Qty	Available	Descript
ADM1232AN	AD	N/a	70	avai	Microprocessor Supervisory Circuit
ADM1232ARM	AD	N/a	9	avai	Microprocessor Supervisory Circuit
ADM1232ARN	AD	N/a	17	avai	Microprocessor Supervisory Circuit
ADM1232ARW	AD	N/a	287	avai	Microprocessor Supervisory Circuit