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AGN20003 , High Sensitivity, with 100mW nominal operating power, in a compact and space saving case
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AGN20012 , High Sensitivity, with 100mW nominal operating power, in a compact and space saving case
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AGN200A03 , High Sensitivity, with 100mW nominal operating power, in a compact and space saving case
ADG902BRM
Wideband, 43 dB Isolation @ 1 GHz, CMOS 1.65 V to 2.75 V, Absorptive/Reflective Switches
REV.A
Wideband, 40 dB Isolation at 1 GHz, CMOS
1.65 V to 2.75 V, SPST Switches
FUNCTIONAL BLOCK DIAGRAMS
CTRL
FEATURES
Wideband Switch: –3 dB @ 4.5 GHz
Absorptive/Reflective Switches
High Off Isolation (40 dB @ 1 GHz)
Low Insertion Loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V Power Supply
CMOS/LVTTL Control Logic
8-Lead MSOP and Tiny 3 mm � 3 mm LFCSP Packages
Low Power Consumption (<1 �A)
APPLICATIONS
Wireless Communications
General-Purpose RF Switching
Dual-Band Applications
High Speed Filter Selection
Digital Transceiver Front End Switch
IF Switching
Tuner Modules
Antenna Diversity SwitchingFigure 1.Off Isolation vs. Frequency
Figure 2.Insertion Loss vs. Frequency
GENERAL DESCRIPTIONThe ADG901/ADG902 are wideband switches that use a
CMOS process to provide high isolation and low insertion loss toGHz. The ADG901 is an absorptive (matched) switch withΩ terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dcto 1GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless applica-
tions and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS–40 dB Off Isolation @ 1 GHz0.8 dB Insertion Loss @ 1 GHzTiny 8-Lead MSOP/LFCSP Packages
ADG901/ADG902–SPECIFICATIONS1AC ELECTRICAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
CAPACITANCE
POWER REQUIREMENTS
NOTESTemperature range B Version: –40°C to +85°C.Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.Point at which insertion loss degrades by 1 dB.Guaranteed by design, not subject to production test.The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured withns rise time pulses and 500MHz bandwidth.
Specifications subject to change without notice.
(VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm,
all specifications TMIN to TMAX, unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS1(TA = 25°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V
Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.3 V2
Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . .30 mA
Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 dBm
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .150°C
MSOP Package
�JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .206°C/W
LFCSP Package
�JA Thermal Impedance (2-layer board) . . . . . . . . . .84°C/W
�JA Thermal Impedance (4-layer board) . . . . . . . . . .48°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . .300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . .235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 kV
NOTESStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.RF1/2 Off Port Inputs to Ground...................................–0.5 V to VDD – 0.5 V
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Table I.Truth Table
PIN CONFIGURATION
8-Lead MSOP (RM-8)
8-Lead 3 mm � 3 mm LFCSP (CP-8)
CTRL
PIN FUNCTION DESCRIPTIONSADG901/ADG902
TERMINOLOGYIDD
GND
CTRL
VINL
VINH
IINL (IINH)
tON
tOFF
tRISE
tFALL
Off Isolation
Insertion Loss
P–1 dB
IP3
Return Loss
Video Feedthrough
TPC 1.Insertion Loss vs. Frequency
over Supplies (S12 and S21)
TPC 4.Insertion Loss vs. Frequency
over Temperature (S12 and S21)
RETURN LOSS (dB)
FREQUENCY (Hz)
10k100k1M10M100M1G10GTPC 7.Return Loss vs. Frequency
(S11)
TPC 2.Insertion Loss vs. Frequency
over Supplies (S12 and S21)
(Zoomed TPC 1 Plot)
TPC 5. OFF Isolation vs. Frequency
over Supplies (S12 and S21)
CH1 = CTRL = 1V/DIV tRISE = 2.8ns
CH2 = RFx = 100mV/DIV tFALL = 5.1ns
CH2
CH1TPC 8.Switch Timing
TPC 3.Insertion Loss vs. Frequency
over Supplies (S12 and S21)
TPC 6.OFF Isolation vs. Frequency
over Temperature (S12 and S21)
CH1 500mV CH2 1mV 10.0nsTPC 9.Video Feedthrough
