ADG759BCP ,3 ohm, 4-/8-Channel Multiplexers in Chip Scale PackageGENERAL DESCRIPTION PRODUCT HIGHLIGHTSThe ADG758 and ADG759 are low voltage, CMOS analog 1. Small 2 ..
ADG774ABRQ ,Low Voltage 400 MHz Quad 2:1 Mux with 3 ns Switching Timespecifications T to T unless otherwise noted.)DD MIN MAX B VersionT toMINParameter 25CT Uni ..
ADG774ABRQZ-REEL , Low Voltage, 400 MHz, Quad 2:1 Mux with 3 ns Switching Time
ADG774BR ,CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Muxspecifications T to T unless otherwise noted.)DD MIN MAX B Version toTMINParameter +258CT Un ..
ADG774BR. ,CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Muxspecifications T to T unless otherwise noted.)DD MIN MAX B Version toTMINParameter +258CT Un ..
ADG774BRQ ,CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 MuxFEATURESFUNCTIONAL BLOCK DIAGRAMLow Insertion Loss and On Resistance: 4 V TypicalOn-Resistance Flat ..
AG201-86 , InGaP HBT Gain Block
AG201-86 , InGaP HBT Gain Block
AG302-86G , InGaP HBT Gain Block
AG303-86 , InGaP HBT Gain Block
AG402-86 , InGaP HBT Gain Block
AG402-89G , AG402-89 InGaP HBT Gain Block
ADG759BCP
3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package
REV.A
3 �, 4-/8-Channel Multiplexers
in Chip Scale Package
FUNCTIONAL BLOCK DIAGRAMS
FEATURES
1.8 V to 5.5 V Single Supply�2.5 V Dual Supply
3 � ON Resistance
0.75 � ON Resistance Flatness
100 pA Leakage Currents
14 ns Switching Times
Single 8-to-1 Multiplexer ADG758
Differential 4-to-1 Multiplexer ADG759
20-Lead 4 mm � 4 mm Chip Scale Package
Low Power Consumption
TTL-/CMOS-Compatible Inputs
For Functionally Equivalent Devices in 16-Lead TSSOP
Package, See ADG708/ADG709
APPLICATIONS
Data Acquisition Systems
Communication Systems
Relay Replacement
Audio and Video Switching
Battery-Powered Systems
GENERAL DESCRIPTIONThe ADG758 and ADG759 are low voltage, CMOS analog
multiplexers comprising eight single channels and four differential
channels, respectively. The ADG758 switches one of eight inputs
(S1–S8) to a common output, D, as determined by the 3-bit
binary address lines A0, A1, and A2. The ADG759 switches one
of four differential inputs to a common differential output as
determined by the 2-bit binary address lines A0 and A1. An EN
input on both devices is used to enable or disable the device. When
disabled, all channels are switched OFF.
Low power consumption and an operating supply range of 1.8 V to
5.5 V make the ADG758 and ADG759 ideal for battery-powered,
portable instruments. All channels exhibit break-before-make
switching action preventing momentary shorting when switch-
ing channels.
These switches are designed on an enhanced submicron process
that provides low power dissipation yet gives high switching
speed, very low ON resistance and leakage currents. ON resistance
is in the region of a few ohms and is closely matched between
switches and very flat over the full signal range. These parts can
operate equally well as either multiplexers or demultiplexers
and have an input signal range that extends to the supplies.
The ADG758 and ADG759 are available in 20-lead chip
scale packages.
PRODUCT HIGHLIGHTSSmall 20-Lead 4 mm × 4 mm Chip Scale Packages (CSP).Single/Dual Supply Operation. The ADG758 and ADG759
are fully specified and guaranteed with 3 V and 5 V single-
supply and ±2.5 V dual-supply rails.Low RON (3 Ω Typical).Low Power Consumption (<0.01 µW).Guaranteed Break-Before-Make Switching Action.
ADG758/ADG759–SPECIFICATIONS1(VDD = 5 V � 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.)POWER REQUIREMENTS
NOTESTemperature range is as follows: B Version: –40°C to +85°C.Guaranteed by design, not subject to production test.
ADG758/ADG759
SPECIFICATIONS1
(VDD = 3 V � 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.)POWER REQUIREMENTS
NOTESTemperature ranges are as follows: B Version: –40°C to +85°C.Guaranteed by design, not subject to production test.
ADG758/ADG759–SPECIFICATIONS1
DUAL SUPPLYPOWER REQUIREMENTS
(VDD = +2.5 V � 10%, VSS = –2.5 V � 10%, GND = 0 V, unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS1(TA = 25°C, unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG758/ADG759 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Chip Scale Package,
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .32°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTESStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
Table I.ADG758 Truth TableX = Don’t Care
Table II.ADG759 Truth TableX = Don’t Care
ORDERING GUIDE
PIN CONFIGURATIONS
TOP VIEW
(Not to Scale)
PIN 1
IDENTIFIEREN
VSS
GND
VDD
ADG758A0A1A2NCNC
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, VSS
ADG758/ADG759
TERMINOLOGY
