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ADG729BRU
CMOS, Low-Voltage, 2-Wire Serially-Controlled, Matrix Switches
aREV. 0
CMOS, Low-Voltage, 2-Wire
Serially-Controlled, Matrix Switches
FUNCTIONAL BLOCK DIAGRAMS2C is a trademark of Philips Corporation.
FEATURES
2-Wire Serial Interface
2.7 V to 5.5 V Single Supply
2.5 � On Resistance
0.75 � On-Resistance Flatness
100 pA Leakage Currents
Single 8-to-1 Matrix Switch ADG728
Dual 4-to-1 Matrix Switch ADG729
Power-On Reset
Small 16-Lead TSSOP Package
APPLICATIONS
Data Acquisition Systems
Communication Systems
Relay Replacement
Audio and Video Switching
Automatic Test Equipment
GENERAL DESCRIPTIONThe ADG728 and ADG729 are CMOS analog matrix switches
with a serially controlled 2-wire interface. The ADG728 is an
8-channel matrix switch, while the ADG729 is a dual 4-channel
matrix switch. On resistance is closely matched between switches
and very flat over the full signal range. These parts can operate
equally well as either multiplexers, demultiplexers or switch
arrays and the input signal range extends to the supplies.
The ADG728 and ADG729 utilize a 2-wire serial interface that
is compatible with the I2C™ interface standard. Both have two
external address pins (A0 and A1). This allows the 2 LSBs of
the 7-bit slave address to be set by the user. Four of each of the
devices can be connected to the one bus. The ADG728 also has
a RESET pin that should be tied high if not in use.
Each channel is controlled by one bit of an 8-bit word. This
means that these devices may be used in a number of different
configurations; all, any, or none of the channels may be on at
any one time.
On power-up of the device, all switches will be in the OFF con-
dition and the internal shift register will contain all zeros.
All channels exhibit break-before-make switching action pre-
venting momentary shorting when switching channels.
The ADG728 and ADG729 are available in 16-lead TSSOP
packages.
PRODUCT HIGHLIGHTS2-Wire Serial Interface.Single Supply Operation. The ADG728 and ADG729 are
fully specified and guaranteed with 3 V and 5 V supply rails.Low On Resistance 2.5 Ω typical.Any configuration of switches may be on at any one time.Guaranteed Break-Before-Make Switching Action.Small 16-Lead TSSOP Package.
ADG728/ADG729–SPECIFICATIONS1(VDD = 5 V � 10%, GND = 0 V, unless otherwise noted.)NOTES
ADG728/ADG729
(VDD = 3 V � 10%, GND = 0 V, unless otherwise noted.)SPECIFICATIONS1NOTESTemperature ranges are as follows: B Versions: –40°C to +85°C.
ADG728/ADG729
TIMING CHARACTERISTICS1t10
NOTESSee Figure 1.A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) in order to bridge the undefined region of
the falling edge of SCL.Cb is the total capacitance of one bus line in pF. tR and tF measured between 0.3 VDD and 0.7 VDD.Input filtering on both the SCL and SDA inputs suppress noise spikes which are less than 50 ns.
Specifications subject to change without notice.
Figure 1.2-Wire Serial Interface Timing Diagram
(VDD = 2.7 V to 5.5 V. All specifications –40�C to +85�C, unless otherwise noted.)
ORDERING GUIDE
PIN FUNCTION DESCRIPTIONS
ADG729
ADG728
PIN CONFIGURATIONS
ADG728/ADG729
ABSOLUTE MAXIMUM RATINGS1(TA = 25°C unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, Each S . . . . . . . . . . . . . . . . . . . . . 30 mA
Continuous Current D, ADG729 . . . . . . . . . . . . . . . . . 80 mA
Continuous Current D, ADG728 . . . . . . . . . . . . . . . . 120 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG728/ADG729 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TSSOP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 27.6°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . . 220°C
NOTESStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
TERMINOLOGYIDD
GND
VD (VS)
∆RON
IS (OFF)
ID, IS (ON)
VINH
IINL (IINH)
CD (OFF)
