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ADG708BRU-ADG708CRU-ADG709BRU-ADG709CRU
CMOS, 3 ohm Low Voltage 4-/8-Channel Multiplexers
REV.0
CMOS, 3 V Low Voltage
4-/8-Channel Multiplexers
FUNCTIONAL BLOCK DIAGRAMS
FEATURES
1.8 V to 5.5 V Single Supply63 V Dual Supply
3 V On-Resistance
0.75 V On-Resistance Flatness
100 pA Leakage Currents
14 ns Switching Times
Single 8-to-1 Multiplexer ADG708
Differential 4-to-1 Multiplexer ADG709
16-Lead TSSOP Package
Low Power Consumption
TTL/CMOS-Compatible Inputs
APPLICATIONS
Data Acquisition Systems
Communication Systems
Relay Replacement
Audio and Video Switching
Battery-Powered Systems
GENERAL DESCRIPTIONThe ADG708 and ADG709 are low voltage, CMOS analog
multiplexers comprising eight single channels and four differential
channels respectively. The ADG708 switches one of eight inputs
(S1–S8) to a common output, D, as determined by the 3-bit
binary address lines A0, A1, and A2. The ADG709 switches one
of four differential inputs to a common differential output as
determined by the 2-bit binary address lines A0 and A1. An EN
input on both devices is used to enable or disable the device. When
disabled, all channels are switched OFF.
Low power consumption and operating supply range of 1.8 V to
5.5 V make the ADG708 and ADG709 ideal for battery-powered,
portable instruments. All channels exhibit break-before-make
switching action preventing momentary shorting when switch-
ing channels.
These switches are designed on an enhanced submicron process
that provides low power dissipation yet gives high switching
speed, very low on-resistance and leakage currents. On-resistance
is in the region of a few ohms and is closely matched between
switches and very flat over the full signal range. These parts can
operate equally well as either Multiplexers or Demultiplexers,
and have an input signal range that extends to the supplies.
The ADG708 and ADG709 are available in a 16-lead TSSOP
package.
PRODUCT HIGHLIGHTSSingle/Dual Supply Operation. The ADG708 and ADG709
are fully specified and guaranteed with 3 V and 5 V single
supply and –3 V dual supply rails.Low RON (3 W Typical).Low Power Consumption (<0.01 mW).Guaranteed Break-Before-Make Switching Action.Small 16-Lead TSSOP Package.
ADG708/ADG709–SPECIFICATIONS1(VDD = 5 V 6 10%, VSS = 0 V, GND = 0 V, unless otherwise noted)ANALOG SWITCH
LEAKAGE CURRENTS
POWER REQUIREMENTS
NOTESTemperature range is as follows: B and C Versions: –40°C to +85°C.Guaranteed by design, not subject to production test.
ADG708/ADG709
SPECIFICATIONS1
(VDD = 3 V 6 10%, VSS = 0 V, GND = 0 V, unless otherwise noted)DYNAMIC CHARACTERISTICS
POWER REQUIREMENTS
NOTESTemperature ranges are as follows: B and C Versions: –40°C to +85°C.Guaranteed by design, not subject to production test.
ADG708/ADG709–SPECIFICATIONS1
DUAL SUPPLYANALOG SWITCH
LEAKAGE CURRENTS
DIGITAL INPUTS
POWER REQUIREMENTS
NOTES
(VDD = +3 V 6 10%, VSS = –3 V 6 10%, GND = 0 V)
ABSOLUTE MAXIMUM RATINGS1(TA = 25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
. . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B, C Versions) . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG708/ADG709 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 432 mWJA Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4°C/WJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 27.6°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTESStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. ADG708 Truth TableX = Don’t Care
Table II.ADG709 Truth TableX = Don’t Care.
ORDERING GUIDE
PIN CONFIGURATIONS
TSSOP
ADG708/ADG709VSS
GND
RON
RFLAT(ON)
IS (OFF)
ID (OFF)
ID, IS (ON)
VD (VS)
CD (OFF)
CD, CS (ON)
CIN
tTRANSITION
TERMINOLOGY
