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ADG3249BRJ-REEL7
2.5 V/3.3 V, 2:1 Multiplexer/Demultiplexer Bus Switch
REV.0
2.5 V/3.3 V, 2:1 Multiplexer/
Demultiplexer Bus Switch
FEATURES
225 ps Propagation Delay through the Switch
4.5 � Switch Connection between Ports
Data Rate 1.244 Gbps
2.5 V/3.3 V Supply Operation
Selectable Level Shifting/Translation
Level Translation
3.3 V to 2.5 V
3.3 V to 1.8 V
2.5 V to 1.8 V
Small Signal Bandwidth 610 MHz
8-Lead SOT-23 Package
APPLICATIONS
3.3 V to 1.8 V Voltage Translation
3.3 V to 2.5 V Voltage Translation
2.5 V to 1.8 V Voltage Translation
Docking Stations
Memory Switching
Analog Switch Applications
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTIONThe ADG3249 is a 2.5 V or 3.3 V, high performance 2:1 multi-
plexer/demultiplexer bus switch. It is designed on a low voltage
CMOS process, which provides low power dissipation yet gives
high switching speed and very low on resistance. This allows the
input to be connected to the output without additional propaga-
tion delay or generating additional ground bounce noise.
Each switch of the ADG3249 conducts equally well in both direc-
tions when on. The ADG3249 exhibits break-before-make
switching action, preventing momentary shorting when switch-
ing channels.
This device is ideal for applications requiring level translation.
When operated from a 3.3V supply, level translation from
3.3V inputs to 2.5V outputs is allowed. Similarly, if the device
is operated from 2.5V supply and 2.5V inputs are applied, the
device will translate the outputs to 1.8V. In addition, a level
translating pin (SEL) is included. When SEL is low, VCC is
reduced internally, allowing for level translating between 3.3V
inputs and 1.8V outputs.
The ADG3249 is available in a tiny 8-lead SOT-23 package.
PRODUCT HIGHLIGHTS3.3 V or 2.5 V supply operation.Extremely low propagation delay through switch.4.5 Ω switches connect inputs to outputs.Tiny SOT-23 package.
ADG3249–SPECIFICATIONS1NOTESTemperature range is as follows: B Version: –40°C to +85°C.Typical values are at 25°C, unless otherwise stated.Guaranteed by design, not subject to production test.The digital switch contributes no propagation delay other than the RC delay of the typical RON of the switch and the load capacitance when driven by an ideal voltage
source. Since the time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay
of the digital switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.Propagation delay matching between channels is calculated from the on resistance matching and load capacitance of 50 pF.See Timing Measurement Information section.This current applies to the control pin EN only. The A and B ports contribute no significant ac or dc currents as they transition.
(VCC = 2.3 V to 3.6 V, GND = 0 V, all specifications TMIN to TMAX,
unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS*(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . 25 mA per Channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
�JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .206°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . .300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . .235°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
PIN CONFIGURATION
8-Lead SOT-23
ORDERING GUIDE
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3249 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table II. Truth Table*SEL = 0 V only when VDD = 3.3 V � 10%
Table I. Pin Function Descriptions
ADG3249
TERMINOLOGYGND
VINH
VINL
IOZ
IOL
RON
�RON
CX OFF
CIN, CSEL, CEN
ICC
�ICC
tPLH, tPHL
tBBM
tTRANS
Max Data Rate
TPC 1.On Resistance vs.
Input Voltage
TPC 4.On Resistance vs. Input
Voltage for Different Temperatures
TPC 7.Pass Voltage vs. VCC
TPC 2.On Resistance vs.
Input Voltage
TPC 5.On Resistance vs. Input
Voltage for Different Temperatures
TPC 8.Pass Voltage vs. VCC
TPC 3.On Resistance vs.
Input Voltage
TPC 6.Pass Voltage vs. VCC
TPC 9.ICC vs. Enable Frequency
ADG3249TPC 10.Output Low Characteristic
TPC 13.Bandwidth vs. Frequency
TPC 16.Enable/Disable Time
vs. Temperature
TPC 11.Output High Characteristic
TPC 14.Crosstalk vs. Frequency
TPC 17.Enable/Disable Time
vs. Temperature
TPC 12.Charge Injection vs.
Source Voltage
TPC 15.Off Isolation vs.
Frequency
TPC 18.Jitter vs. Data Rate;
PRBS 31
