ADG3233BRM ,Low Voltage 1.65 V to 3.6 V, (Up/Down) Logic Level Translation, Bypass SwitchCHARACTERISTICSV = V = V = 3.3 V ± 0.3 VCC CC1 CC2 Propagation Delay, t PDA1 to Y1 Normal Mode t ..
ADG3242BRJ-REEL ,2.5 V/3.3 V, 2-Bit, Common Control Level Translator Bus SwitchCHARACTERISTICS4Propagation Delay A to B or B to A, t t , t C = 50 pF, V = SEL = 3 V 0.225 nsPD PHL ..
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ADG3247BRU ,2.5 V/3.3 V, 16 Bit (Dual 8 Bit) , 2 Port Level Translator, Bus SwitchSpecifications subject to change without notice.–2– REV. 0ADG3247ABSOLUTE MAXIMUM RATINGS* LFCSP Pa ..
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AF100-1CN ,+/-18 V, 900 mW, universal active filterFeatures
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AF216M245001-T , CHIP ANTENNA
ADG3233BRM
Low Voltage 1.65 V to 3.6 V, (Up/Down) Logic Level Translation, Bypass Switch
REV.0
Low Voltage 1.65 V to 3.6 V, Bidirectional
Logic Level Translation, Bypass Switch
PRODUCT HIGHLIGHTSBidirectional level translation matches any voltage level from
1.65V to 3.6V.The bypass switch offers high performance and is fully
guaranteed across the supply range.Short circuit protection.Tiny 8-lead SOT-23 package, 8.26 mm � 8.26 mm board area,
or 8-lead MSOP.
Table I.Truth Table*Patent Pending
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Operates from 1.65 V to 3.6 V Supply Rails
Bidirectional Level Translation, Unidirectional
Signal Path
8-Lead SOT-23 and MSOP Packages
Bypass or Normal Operation
Short Circuit Protection
APPLICATIONS
JTAG Chain Bypassing
Daisy-Chain Bypassing
Digital Switching
GENERAL DESCRIPTIONThe ADG3233 is a bypass switch designed on a submicron
process that operates from supplies as low as 1.65 V. The device
is guaranteed for operation over the supply range 1.65 V to 3.6V.
It operates from two supply voltages, allowing bidirectional level
translation, i.e., it translates low voltages to higher voltages and
vice versa. The signal path is unidirectional, meaning data may
only flow from A to Y.
This type of device may be used in applications that require a
bypassing function. It is ideally suited to bypassing devices in a
JTAG chain or in a daisy-chain loop. One switch could be used for
each device or a number of devices, thus allowing easy bypassing
of one or more devices in a chain. This may be particularly
useful in reducing the time overhead in testing devices in the
JTAG chain or in daisy-chain applications where the user does
not wish to change the settings of a particular device.
The bypass switch is packaged in two of the smallest footprints
available for its required pin count. The 8-lead SOT-23 package
requires only 8.26 mm � 8.26 mm board space, while the MSOP
package occupies approximately 15 mm � 15 mm board area.
ADG3233–SPECIFICATIONS1
(VCC1 = VCC2 = 1.65 V to 3.6 V, GND = 0 V, All specifications TMIN to TMAX, unless
otherwise noted.)
ADG3233SWITCHING CHARACTERISTICS
POWER REQUIREMENTS
NOTESTemperature range is as follows: B Version: –40°C to +85°C.All typical values are at VCC = VCC1 = VCC2, TA = 25°C, unless otherwise stated.VIL and VIH levels are specified with respect to VCC1, VOH and VOL levels for Y1 are specified with respect to VCC1, and VOH and VOL levels are specified for Y2 with
respect to VCC2.Guaranteed by design, not subject to production test.See Test Circuits and Waveforms.
Specifications subject to change without notice.
ADG3233
ABSOLUTE MAXIMUM RATINGS*(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . .–0.3 V to +4.6 V
A1, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +4.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to VCC1 + 0.3V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
8-Lead MSOP
�JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .206°C/W
�JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .43°C/W
8-Lead SOT-23
�JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . .211°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . .300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . .235°CStresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maximum
rating may be applied at any one time.
PIN CONFIGURATIONS
8-Lead SOT-23 Package (RJ-8)
8-Lead MSOP Package (RM-8)
PIN FUNCTION DESCRIPTIONS
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ORDERING GUIDE
ModelADG3233BRJ-REEL
ADG3233BRJ-REEL7
ADG3233BRM
ADG3233BRM-REEL
ADG3233BRM-REEL7
VCC1 – V
ICC1
– nA
1.52.03.02.53.54.0TPC 1.ICC1 vs. VCC1
TPC 4.ICC2 vs. Temperature
TPC 7.ICC2 vs. Frequency,
Normal Mode
TPC 3.ICC1 vs. Temperature
TPC 6.ICC1 vs. Frequency,
Bypass Mode
SUPPLY – V
TIME – ns4
1.52.03.02.53.54.0TPC 9.Y1 Enable, Disable Time
vs. Supply
VCC2 – V
ICC2
– nA
1.52.03.02.53.54.0TPC 2.ICC2 vs. VCC2
TPC 5.ICC1 vs. Frequency,
Normal Mode
TPC 8.ICC2 vs. Frequency,
Bypass Mode
ADG3233TPC 11.Y1 Enable, Disable
Time vs. Temperature
CAPACITIVE LOAD – pF
RISE/FALL TIME – ns10292827262524232TPC 14.Rise/Fall Time vs. Capacitive
Load, A1–Y2, Bypass Mode
CAPACITIVE LOAD – pF
PROPAGATION DELAY – ns10292827262524232TPC 17.Propagation Delay
vs. Capacitive Load A1 to Y1
SUPPLY – V
TIME – ns4
1.52.03.02.53.54.0TPC 10.Y2 Enable, Disable
Time vs. Supply
CAPACITIVE LOAD – pF
RISE/FALL TIME – ns10292827262524232TPC 13.Rise/Fall Time vs.
Capacitive Load, A1–Y1, A2–Y2
CAPACITIVE LOAD – pF
RISE/FALL TIME – ns10292827262524232TPC 16.Rise/Fall Time vs. Capacitive
Load, A1–Y2, Bypass Mode
TPC 12.Y2 Enable, Disable
Time vs. Temperature
CAPACITIVE LOAD – pF
RISE/FALL TIME – ns10292827262524232TPC 15.Rise/Fall Time vs. Capacitive
Load, A1–Y1, A2–Y2
TPC 18.Propagation Delay
vs. Capacitive Load A2 to Y2
