AD8605ART-REEL7 ,Precision Low Noise CMOS Single Rail-to-Rail Input/Output Op AmpApplications for these amplifiers include optical 7 8OUT B OUT Ccontrol loops, portable and loop-po ..
AD8605ARTZ-REEL , Precision, Low Noise, CMOS, Rail-to-Rail, Input/Output Operational Amplifiers
AD8606AR ,Precision Low noise CMOS Rail-to-Rail Input/Output Operational AmplifiersPRELIMINARY TECHNICAL DATA Precision Low noise CMOS a Rail-to-Rail Input/Output Operational Am ..
AD8606ARM ,Precision Low noise CMOS Rail-to-Rail Input/Output Operational Amplifiersapplications. Filters, integrators, photo-diode amplifiers and high REV. Pr0 8/29/2001 Informatio ..
AD8606ARZ-REEL7 , Precision, Low Noise, CMOS, Rail-to-Rail, Input/Output Operational Amplifiers
AD8607AR ,Precision Micropower Low Noise CMOS Rail-Rail Input/Output Operational AmplifiersFEATURES PIN CONFIGURATIONS Low offset voltage: 50 µV max OUT 1 5 V+Low input bias current: 1 pA ma ..
ADS1178IPAPT ,Octal, Simultaneous Sampling, 16-Bit Analog-to-Digital Converter 64-HTQFP -40 to 85ELECTRICAL CHARACTERISTICSLimit specifications at T = –40°C to +105°C. Typical specifications at T ..
ADS1178IPAPT ,Octal, Simultaneous Sampling, 16-Bit Analog-to-Digital Converter 64-HTQFP -40 to 85MAXIMUM RATINGS(1)over operating free-air temperature range unless otherwise notedPARAMETER ADS1174 ..
ADS1198CPAG ,Low-Noise, 8 Channel, 16 Bit Analog Front End for ECG/EEG Measurements 64-TQFP 0 to 70FEATURESperformance, the ADS1194/6/8 family enables the23• Eight Low-Noise PGAs andcreation of scal ..
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AD8605ART-REEL7
Precision Low Noise CMOS Single Rail-to-Rail Input/Output Op Amp
Precision Low Noise CMOS Rail-to-Rail
Input/Output Operational Amplifiers
Rev. D
FEATURES
Low offset voltage: 65 µV maximum
Low input bias currents: 1 pA maximum
Low noise: 8 nV/√Hz
Wide bandwidth: 10 MHz
High open-loop gain: 120 dB
Unity gain stable
Single-supply operation: 2.7 V to 5.5 V
MicroCSP™
GENERAL DESCRIPTION The AD8605, AD8606, and AD86081 are single, dual, and quad
rail-to-rail input and output, single-supply amplifiers. They
feature very low offset voltage, low input voltage and current
noise, and wide signal bandwidth. They use Analog Devices’
patented DigiTrim® trimming technique, which achieves
superior precision without laser trimming.
The combination of low offsets, low noise, very low input bias
currents, and high speed makes these amplifiers useful in a
wide variety of applications. Filters, integrators, photodiode
amplifiers, and high impedance sensors all benefit from the
combination of performance features. Audio and other ac
applications benefit from the wide bandwidth and low
distortion. Applications for these amplifiers include optical
control loops, portable and loop-powered instrumentation,
and audio amplification for portable devices.
The AD8605, AD8606, and AD8608 are specified over the
extended industrial temperature range (−40°C to +125°C). The
AD8605 single is available in the 5-lead SOT-23 and 5-bump
MicroCSP packages. The 5-bump MicroCSP offers the smallest
available footprint for any surface-mount operational amplifier.
The AD8606 dual is available in an 8-lead MSOP package and a
narrow SOIC surface-mount package. The AD8608 quad is
available in a 14-lead TSSOP and a narrow 14-lead SOIC
package. MicroCSP, SOT, MSOP, and TSSOP versions are
available in tape and reel only.
. Patent No. 5,969,657; other patents pending.
APPLICATIONS
Photodiode amplification
Battery-powered instrumentation
Multipole filters
Sensors
Barcode scanners
Audio
FUNCTIONAL BLOCK DIAGRAMS –IN+INOUTV–02731-D-001
–IN A
+IN A
OUT B
–IN B
+IN B02731-D-005
Figure 1. 5-Lead SOT-23 (RT Suffix) Figure 2. 8-Lead SOIC (R Suffix)
AD8605 ONLY
TOP VIEW
(BUMP SIDE DOWN)02731-D-006
–IN A
+IN A
+IN B
–IN B
OUT B
OUT A02731-D-004
Figure 3. 5-Bump MicroCSP
(CB Suffix)
Figure 4. 14-Lead SOIC (R Suffix)
–IN A
+IN A
OUT A02731-D-003
–IN A+IN AV+
+IN B
–IN B02731-D-002
Figure 5. 8-Lead MSOP (RM Suffix) Figure 6. 14-Lead TSSOP (RU Suffix)
TABLE OF CONTENTS 5 V Electrical Specifications............................................................3
2.7 V Electrical Specifications.........................................................5
Absolute Maximum Ratings............................................................6
ESD Caution..................................................................................6
Typical Performance Characteristics.............................................7
Application Information................................................................13
Output Phase Reversal...............................................................13
Maximum Power Dissipation...................................................13
Input Overvoltage Protection...................................................13
THD + Noise...............................................................................13
Total Noise Including Source Resistors...................................14
Channel Separation....................................................................14
Capacitive Load Drive...............................................................14
Light Sensitivity..........................................................................15
MicroCSP Assembly Considerations.......................................15
I-V Conversion Applications........................................................16
Photodiode Preamplifier Applications....................................16
Audio and PDA Applications...................................................16
Instrumentation Amplifiers......................................................17
D/A Conversion.........................................................................17
Outline Dimensions.......................................................................18
Ordering Guide..........................................................................19
REVISION HISTORY
5/04—Data Sheet Changed from Rev. C to Rev. D Updated Format.............................................................Universal
Edit to Light Sensitivity Section...............................................16
Updated Outline Dimensions...................................................19
Changes to Ordering Guide......................................................20
7/03—Data Sheet Changed from Rev. B to Rev. C Changes to Features.......................................................................1
Change to General Description...................................................1
Addition to Functional Block Diagrams....................................1
Addition to Absolute Maximum Ratings...................................4
Addition to Ordering Guide........................................................4
Change to Equation In Maximum Power Dissipation
Section........................................................................................11
Added Light Sensitivity Section.................................................12
Added New Figure 8 and Renumbered Subsequent Figures.13
Added New MicroCSP Assembly Considerations Section....13
Changes to Figure 9.....................................................................13
Change to Equation in Photodiode Preamplifier
Applications Section ................................................................13
Changes to Figure 12...................................................................14
Change to Equation in D/A Conversion Section....................14
Updated Outline Dimensions ...................................................15
3/03—Data Sheet Changed from Rev. A to Rev. B Changes to Functional Block Diagram.......................................1
Changes to Absolute Maximum Ratings....................................4
Changes to Ordering Guide ....................................................... 4
Changes to Figure 9 ....................................................................13
Updated Outline Dimensions....................................................15
11/02—Data Sheet Changed from Rev. 0 to Rev. A Change to Electrical Characteristics...........................................2
Changes to Absolute Maximum Ratings....................................4
Changes Ordering Guide .............................................................4
Change to TPC 6 ..........................................................................5
Updated Outline Dimensions....................................................15
5 V ELECTRICAL SPECIFICATIONS
Table 1. @ VS = 5 V, VCM = VS/2, TA = 25°C, unless otherwise noted.
2.7 V ELECTRICAL SPECIFICATIONS
Table 2. @ VS = 2.7 V, VCM = VS/2, TA = 25°C, unless otherwise noted.
ABSOLUTE MAXIMUM RATINGSStresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Table 4. Package Type θJA is specified for worst-case conditions, i.e., θJA is specified for device in
socket for PDIP packages; θJA is specified for device soldered onto a circuit
board for surface-mount packages.
ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
TYPICAL PERFORMANCE CHARACTERISTICS
OFFSET VOLTAGE (mV)
NUM
ER OF AM
PLIFIERS
3500Figure 7. Input Offset Voltage Distribution
TCVOS (mV/°C)
NUMBE
R OF AMP
IFIEFigure 8. AD8608 Input Offset Voltage Drift Distribution
TCVOS (mV/°C)
NUMBE
R OF AMP
IFIEFigure 9. AD8605/AD8606 Input Offset Voltage Drift Distribution
T OFFSET VOLTA
E (
COMMON-MODE VOLTAGE (V)Figure 10. Input Offset Voltage vs. Common-Mode Voltage
(200 Units, 5 Wafer Lots, Including Process Skews)
TEMPERATURE (°C)
INP
T BIAS
CURRE
NT (pA)
320Figure 11. Input Bias Current vs. Temperature
LOAD CURRENT (mA)
OUT
(mV
10002731-D-012
Figure 12. Output Voltage to Supply Rail vs. Load Current
TEMPERATURE (°C)
OUTPUT VOLTAGE (
4.800Figure 13. Output Voltage Swing vs. Temperature
TEMPERATURE (°C)
OUTPUT VOLTAGE (Figure 14. Output Voltage Swing vs. Temperature
GAIN (
SE (
egrees)
FREQUENCY (Hz)02731-D-015
Figure 15. Open-Loop Gain and Phase vs. Frequency
FREQUENCY (Hz)
OUTPUT SWING (V p-p)Figure 16. Closed-Loop Output Voltage Swing
FREQUENCY (Hz)
OUTP
UT IMP
DANCEFigure 17. Output Impedance vs. Frequency
FREQUENCY (Hz)
10k
CMRR (dB)
100k1M20
12010M
10002731-D-018
Figure 18. Common-Mode Rejection Ratio vs. Frequency
FREQUENCY (Hz)
RR (dB)Figure 19. PSRR vs. Frequency
CAPACITANCE (pF)
L SIGN
OVER
OOT (Figure 20. Small Signal Overshoot vs. Load Capacitance
TEMPERATURE (°C)
CURRE
NT/AMP
LIFIE
(mA)
–50125–35–20951105203550658002731-D-021
Figure 21. Supply Current vs. Temperature
SUPPLY VOLTAGE (V)
CURRE
NT/AMP
LIFIE
(mA)
0.85.04.54.03.53.02.52.01.51.00.502731-D-022
Figure 22. Supply Current vs. Supply Voltage
TIME (1s/DIV)
VOLTA
GE N
ISE (
V/D
IV)02731-D-023
Figure 23. 0.1 Hz to 10 Hz Input Voltage Noise
TIME (200ns/DIV)
VOLTA
E (
50mV/D
IV)02731-D-024
Figure 24. Small Signal Transient Response
TIME (400ns/DIV)
VOLTA
GE (
V/D
IV)02731-D-025
Figure 25. Large Signal Transient Response
TIME (400ns/DIV)02731-D-026
Figure 26. Negative Overload Recovery
TIME (400ns/DIV)02731-D-027
Figure 27. Positive Overload Recovery
FREQUENCY (kHz)
VOLTA
GE N
ISE D
ITY (
Hz)1.00.90.80.70.60.50.40.30.20.102731-D-028
Figure 28. Voltage Noise Density
FREQUENCY (kHz)
VOLTA
GE N
ISE D
ITY (
Hz)98765432102731-D-029
Figure 29. Voltage Noise Density
FREQUENCY (Hz)
VOLTA
GE N
ISE D
ITY (
Hz)10090807060504030201002731-D-030
Figure 30. Voltage Noise Density