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AD8601ART-REEL-AD8602ARM-R2-AD8602ARM-REEL-AD8602AR-REEL
DigiTrim™ Single Rail-to-Rail Input and Output Amplifier with Very Low Offset Voltage and Wide Bandwidths
REV.D
Precision CMOS Single-Supply
Rail-to-Rail Input/Output Wideband
Operational Amplifiers
FEATURES
Low Offset Voltage: 500 �V Max
Single-Supply Operation: 2.7 V to 5.5 V
Low Supply Current: 750 �A/Amplifier
Wide Bandwidth: 8 MHz
Slew Rate: 5 V/�s
Low Distortion
No Phase Reversal
Low Input Currents
Unity Gain Stable
APPLICATIONS
Current Sensing
Barcode Scanners
PA Controls
Battery-Powered Instrumentation
Multipole Filters
Sensors
ASIC Input or Output Amplifiers
Audio
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTIONThe AD8601, AD8602, and AD8604 are single, dual, and quad
rail-to-rail input and output single-supply amplifiers featuring very
low offset voltage and wide signal bandwidth. These amplifiers
use a new, patented trimming technique that achieves superior
performance without laser trimming. All are fully specified to
operate on a 3 V to 5 V single supply.
The combination of low offsets, very low input bias currents,
and high speed make these amplifiers useful in a wide variety of
applications. Filters, integrators, diode amplifiers, shunt current
sensors, and high impedance sensors all benefit from the combi-
nation of performance features. Audio and other ac applications
benefit from the wide bandwidth and low distortion. For the
most cost-sensitive applications, the D grades offer this ac per-
formance with lower dc precision at a lower price point.
Applications for these amplifiers include audio amplification for
portable devices, portable phone headsets, bar code scanners,
portable instruments, cellular PA controls, and multipole filters.
The ability to swing rail-to-rail at both the input and output
enables designers to buffer CMOS ADCs, DACs, ASICs, and
other wide output swing devices in single-supply systems.
The AD8601, AD8602, and AD8604 are specified over the
extended industrial (–40°C to +125°C) temperature range. The
AD8601, single, is available in the tiny 5-lead SOT-23 package.
The AD8602, dual, is available in 8-lead MSOP and narrow
SOIC surface-mount packages. The AD8604, quad, is available
in 14-lead TSSOP and narrow SOIC packages.
SOT, MSOP, and TSSOP versions are available in tape and
reel only.
14-Lead TSSOP
(RU Suffix)
14-Lead SOIC
(R Suffix)
5-Lead SOT-23
(RT Suffix)
8-Lead MSOP
(RM Suffix)
8-Lead SOIC
(R Suffix)
AD8601/AD8602/AD8604–SPECIFICATIONS
(VS = 3 V, VCM = VS/2, TA = 25�C, unless otherwise noted.)NOISE PERFORMANCE
*For VCM between 1.3 V and 1.8 V, VOS may exceed specified value.
Specifications subject to change without notice.
ELECTRICAL CHARACTERISTICS
AD8601/AD8602/AD8604
ELECTRICAL CHARACTERISTICSSpecifications subject to change without notice.
(VS = 5.0 V, VCM = VS/2, TA = 25�C, unless otherwise noted.)
AD8601/AD8602/AD8604
ABSOLUTE MAXIMUM RATINGS*Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . .GND to VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Storage Temperature Range
R, RM, RT, RU Packages . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
AD8601/AD8602/AD8604 . . . . . . . . . . . . –40°C to +125°C
Junction Temperature Range
R, RM, RT, RU Packages . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . .300°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV HBM
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE5-Lead SOT-23 (RT)
8-Lead SOIC (R)
8-Lead MSOP (RM)
14-Lead SOIC (R)
*�JA is specified for worst-case conditions, i.e., �JA is specified for device in
socket for PDIP packages; �JA is specified for device soldered onto a circuit
board for surface-mount packages.
CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8601/AD8602/AD8604 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
INPUT OFFSET VOLTAGE – mV
3,000
1,500�1.0
1.0�0.8
QUANTITY – Amplifiers�0.6�0.4�0.2
00.20.40.60.8
2,500
2,000
1,000
500TPC 1. Input Offset Voltage Distribution
INPUT OFFSET VOLTAGE – mV
3,000
1,500�1.0
1.0�0.8
QUANTITY – Amplifiers�0.6�0.4�0.2
00.20.40.60.8
2,500
2,000
1,000
500TPC 2. Input Offset Voltage Distribution
TPC 3. Input Offset Voltage Drift Distribution
TPC 4. Input Offset Voltage Drift Distribution
COMMON-MODE VOLTAGE – V
1.5�2.0
03.00.5
INPUT OFFSET VOLTAGE – mV
0.5�1.0
�1.5
�0.5
TPC 5. Input Offset Voltage vs. Common-Mode Voltage
TPC 6. Input Offset Voltage vs. Common-Mode Voltage
AD8601/AD8602/AD8604TPC 7. Input Bias Current vs. Temperature
TPC 8. Input Bias Current vs. Temperature
COMMON-MODE VOLTAGE – V
INPUT BIAS CURRENT – pA
2.02.53.03.50.51.01.54.55.0TPC 9. Input Bias Current vs. Common-Mode Voltage
TPC 10. Input Offset Current vs. Temperature
TPC 11. Input Offset Current vs. Temperature
TPC 12. Output Voltage to Supply Rail vs. Load Current
TPC 16. Output Voltage Swing vs. Temperature
TPC 17. Output Voltage Swing vs. Temperature
TPC 18. Open-Loop Gain and Phase vs. Frequency
LOAD CURRENT – mA
10k
OUTPUT VOLTAGE – mV
100TPC 13. Output Voltage to Supply Rail vs. Load Current
TPC 14. Output Voltage Swing vs. Temperature
TPC 15. Output Voltage Swing vs. Temperature
AD8601/AD8602/AD8604TPC 19. Open-Loop Gain and Phase vs. Frequency
FREQUENCY – Hz100M10k
CLOSED-LOOP GAIN – dB
100k1M10MTPC 20. Closed-Loop Gain vs. Frequency
FREQUENCY – Hz100M10k
CLOSED-LOOP GAIN – dB
100k1M10MTPC 21. Closed-Loop Gain vs. Frequency
FREQUENCY – Hz
2.51k10M10k
OUTPUT SWING – V p-p
100k1M
1.0TPC 22. Closed-Loop Output Voltage Swing vs. Frequency
FREQUENCY – Hz1k10M10k
OUTPUT SWING – V p-p
100k1MTPC 23. Closed-Loop Output Voltage Swing vs. Frequency
FREQUENCY – Hz
10010M1k
OUTPUT IMPEDANCE –
10k100k1M
200TPC 24. Output Impedance vs. Frequency
FREQUENCY – Hz
10010M1k
OUTPUT IMPEDANCE –
10k100k1M
200TPC 25. Output Impedance vs. Frequency
TPC 26. Common-Mode Rejection Ratio vs. Frequency
TPC 27. Common-Mode Rejection Ratio vs. Frequency
TPC 28. Power Supply Rejection Ratio vs. Frequency
CAPACITANCE – pF101k100
SMALL SIGNAL OVERSHOOT – %TPC 29. Small Signal Overshoot vs. Load Capacitance
CAPACITANCE – pF101k100
SMALL SIGNAL OVERSHOOT – %TPC 30. Small Signal Overshoot vs. Load Capacitance
AD8601/AD8602/AD8604TPC 34. Total Harmonic Distortion + Noise vs. Frequency
TPC 35. Voltage Noise Density vs. Frequency
FREQUENCY – kHz0.51.01.52.02.5
VOLTAGE NOISE DENSITY – nV/TPC 36. Voltage Noise Density vs. Frequency
TPC 31. Supply Current per Amplifier vs. Temperature
TPC 32. Supply Current per Amplifier vs. Temperature
TPC 33. Supply Current per Amplifier vs. Supply Voltage
