74VCX16244DT ,Low-Voltage 1.8/2.5/3.3V 16-Bit Buffer With 3.6 V-Tolerant Inputs and Outputs (3-State, Non-Inverting)ELECTRICAL CHARACTERISTICST = −40°C to +85°CAMin MaxSymbol Characteristic Condition UnitV HIGH Leve ..
74VCX16244G ,Low Voltage 16-Bit Buffer/Line Driver with 3.6V Tolerant Inputs and Outputsapplications with I/O capability up to 3.6V.CC
74VCX16244-74VCX16244DT
Low-Voltage 1.8/2.5/3.3V 16-Bit Buffer With 3.6 V-Tolerant Inputs and Outputs (3-State, Non-Inverting)
74VCX16244
Low-Voltage 1.8V/2.5V/3.3V
16-Bit Buffer
With 3.6 V−Tolerant Inputs and Outputs
(3−State, Non−Inverting)The 74VCX16244 is an advanced performance, non−inverting
16−bit buffer. It is designed for very high−speed, very low−power
operation in 1.8 V, 2.5 V or 3.3 V systems.
When operating at 2.5 V (or 1.8 V) the part is designed to tolerate
voltages it may encounter on either inputs or outputs when interfacing
to 3.3 V busses. It is guaranteed to be overvoltage tolerant to 3.6 V.
The 74VCX16244 is nibble controlled with each nibble functioning
identically, but independently. The control pins may be tied together to
obtain full 16−bit operation. The 3−state outputs are controlled by an
Output Enable (OEn) input for each nibble. When OEn is LOW, the
outputs are on. When OEn is HIGH, the outputs are in the high
impedance state.
Features Designed for Low Voltage Operation: VCC = 1.65 V − 3.6 V 3.6 V Tolerant Inputs and Outputs High Speed Operation: 2.5 ns max for 3.0 V to 3.6 V
3.0 ns max for 2.3 V to 2.7 V
6.0 ns max for 1.65 V to 1.95 V Static Drive: ±24 mA Drive at 3.0 V
±18 mA Drive at 2.3 V
±6 mA Drive at 1.65 V Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0 V Near Zero Static Supply Current in All Three Logic States (20 �A)
Substantially Reduces System Power Requirements Latchup Performance Exceeds ±250 mA @ 125°C ESD Performance: Human Body Model >2000 V;
Machine Model >200 V All Devices in Package TSSOP are Inherently Pb−Free*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
MARKING DIAGRAM = Assembly Location = Wafer Lot = Year = Work Week
TSSOP−48
DT SUFFIX
CASE 1201
ORDERING INFORMATION†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
http://
