74LVTH374 ,Low Voltage Octal D-Type Flip-Flop with 3-STATE OutputsFeaturesThe LVT374 and LVTH374 are high-speed, low-power
74LVTH374
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
74LVT374 • 74LVTH374 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs September 1999 Revised November 2000 74LVT374 74LVTH374 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs General Description Features The LVT374 and LVTH374 are high-speed, low-powerInput and output interface capability to systems at octal D-type flip-flops featuring separate D-type inputs for 5V V CC each flip-flop and 3-STATE outputs for bus-oriented appli- Bus-Hold data inputs eliminate the need for external cations. A buffered Clock (CP) and Output Enable (OE) are pull-up resistors to hold unused inputs (74LVTH374), common to all flip-flops. also available without bushold feature (74LVT374). The LVTH374 data inputs include bushold, eliminating the Live insertion/extraction permitted need for external pull-up resistors to hold unused inputs. Power Up/Down high impedance provides glitch-free These octal flip-flops are designed for low-voltage (3.3V) bus loading V applications, but with the capability to provide a TTL CC Outputs source/sink −32 mA/+64 mA interface to a 5V environment. The LVT374 and LVTH374 Functionally compatible with the 74 series 374 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT whileLatch-up performance exceeds 500 mA maintaining low power dissipation.ESD performance: Human-body model > 2000V Machine model > 200V Charged-device model > 1000V Ordering Code: Order Number Package Number Package Description 74LVT374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVT374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH374WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LVTH374SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH374MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. IEEE/IEC Logic Symbols © 2000 DS012016
