74LVTH16500 ,Low Voltage 18-Bit Universal Bus Transceivers with Bushold and 3-STATE Outputsapplications, but with the capability to provide a TTL inter-Human-Body Model > 2000Vface to a 5V e ..
74LVTH16501 ,Low Voltage 18-Bit Universal Bus Transceivers with Bushold and 3-STATE OutputsFeaturesThe LVTH16501 is an 18-bit universal bus transceiver
74LVTH16500
Low Voltage 18-Bit Universal Bus Transceivers with Bushold and 3-STATE Outputs
74LVTH16500 Low Voltage 18-Bit Universal Bus Transceivers with Bushold and 3-STATE Outputs March 2001 Revised August 2001 74LVTH16500 Low Voltage 18-Bit Universal Bus Transceivers with Bushold and 3-STATE Outputs General Description Features The LVTH16500 is an 18-bit universal bus transceiverInput and output interface capability to systems at combining D-type latches and D-type flip-flops to allow 5V V CC data flow in transparent, latched, and clocked modes. Bushold data inputs eliminate the need for external Data flow in each direction is controlled by output-enable pull-up resistors to hold unused inputs (OEAB and OEBA), latch-enable (LEAB and LEBA), and Live insertion/extraction permitted clock (CLKAB and CLKBA) inputs. Power up/down high impedance provides glitch-free bus The LVTH16500 data inputs include bushold, eliminating loading the need for external pull-up resistors to hold unused Outputs source/sink −32 mA/+64 mA inputs. Functionally compatible with the 74 series 16500 The transceiver is designed for low voltage (3.3V) V CC ESD Performance: applications, but with the capability to provide a TTL inter- Human-Body Model > 2000V face to a 5V environment. The LVTH16500 is fabricated with an advanced BiCMOS technology to achieve high Machine Model > 200V speed operation similar to 5V ABT while maintaining low Charged-Device Model > 1000V power dissipation. Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Order Number Package Number Package Description 74LVTH16500GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [TAPE and REEL] 74LVTH16500MEA MS56A 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LVTH16500MTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix “X” to the ordering code. © 2001 DS012447
