74LVTH574WMX ,Low Voltage Octal D-Type Flip-Flop with 3-STATE OutputsFeaturesThe LVT574 and LVTH574 are high-speed, low-power
74LVT574MTC-74LVT574MTCX-74LVT574WM-74LVTH574MTC-74LVTH574MTCX-74LVTH574WMX
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs
74LVT574 • 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs March 1999 Revised November 2000 74LVT574 74LVTH574 Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs General Description Features The LVT574 and LVTH574 are high-speed, low-powerInput and output interface capability to systems at octal D-type flip-flop featuring separate D-type inputs for 5V V CC each flip-flop and 3-STATE outputs for bus-oriented appli- Bushold data inputs eliminate the need for external cations. A buffered Clock (CP) and Output Enable (OE) are pull-up resistors to hold unused inputs (74LVTH574), common to all flip-flops. also available without bushold feature (74LVT574). The LVTH574 data inputs include bushold, eliminating the Live insertion/extraction permitted need for external pull-up resistors to hold unused inputs. Power Up/Down high impedance provides glitch-free These octal flip-flops are designed for low-voltage (3.3V) bus loading V applications, but with the capability to provide a TTL CC Outputs source/sink −32 mA/+64 mA interface to a 5V environment. The LVT574 and LVTH574 Functionally compatible with the 74 series 574 are fabricated with an advanced BiCMOS technology to Latch-up performance exceeds 500 mA achieve high speed operation similar to 5V ABT while maintaining a low power dissipation.ESD performance: Human-body model > 2000V Machine model > 200V Charged-device model > 1000V Ordering Code: Order Number Package Number Package Description 74LVT574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVT574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVT574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVTH574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVTH574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbols IEEE/IEC © 2000 DS012451
