74LVT240 ,Low Voltage Octal Buffer/Line Driver with 3-STATE OutputsFeaturesThe LVT240 and LVTH240 are inverting octal buffers and
74LVT240
Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
74LVT240 • 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs July 1999 Revised November 2000 74LVT240 74LVTH240 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs General Description Features The LVT240 and LVTH240 are inverting octal buffers andInput and output interface capability to systems at line drivers designed to be employed as memory address 5V V CC drivers, clock drivers and bus oriented transmitters or Bushold data inputs eliminate the need for external receivers which provides improved PC board density. pull-up resistors to hold unused inputs (74LVTH240), The LVTH240 data inputs include bushold, eliminating the also available without bushold feature (74LVT240). need for external pull-up resistors to hold unused inputs. Live insertion/extraction permitted These octal buffers and line drivers are designed for low- Power Up/Down high impedance provides glitch-free voltage (3.3V) V applications, but with the capability to CC bus loading provide a TTL interface to a 5V environment. The LVT240 Outputs source/sink −32 mA/+64 mA and LVTH240 are fabricated with an advanced BiCMOS Functionally compatible with the 74 series 240 technology to achieve high speed operation similar to 5V Latch-up performance exceeds 500 mA ABT while maintaining low power dissipation. ESD performance: Human-body model > 2000V Machine model > 200V Charged-device model > 1000V Ordering Code: Order Number Package Number Package Description 74LVT240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVT240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT240MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVT240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVTH240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH240MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVTH240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. © 2000 DS500153
