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74LVT16245FAIRCHIL ?N/a13avaiLow Voltage 16-Bit Transceiver with 3-STATE Outputs


74LVT16245 ,Low Voltage 16-Bit Transceiver with 3-STATE OutputsFeaturesThe LVT16245 and LVTH16245 contain sixteen non-invert-

74LVT16245
Low Voltage 16-Bit Transceiver with 3-STATE Outputs
74LVT16245 • 74LVTH16245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs January 1999 Revised August 2001 74LVT16245  74LVTH16245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs General Description Features The LVT16245 and LVTH16245 contain sixteen non-invert-Input and output interface capability to systems at ing bidirectional buffers with 3-STATE outputs and is 5V V CC intended for bus oriented applications. The device is byte Bushold data inputs eliminate the need for external controlled. Each byte has separate control inputs which pull-up resistors to hold unused inputs (74LVTH16245), can be shorted together for full 16-bit operation. The T/R also available without bushold feature (74LVT16245). inputs determine the direction of data flow through the Live insertion/extraction permitted device. The OE inputs disable both the A and B ports by Power Up/Down high impedance provides glitch-free placing them in a high impedance state. bus loading The LVTH16245 data inputs include bushold, eliminating Outputs source/sink −32 mA/+64 mA the need for external pull-up resistors to hold unused inputs.Functionally compatible with the 74 series 16245 These non-inverting transceivers are designed forLatch-up performance exceeds 500 mA low-voltage (3.3V) V applications, but with the capability CCESD performance: to provide a TTL interface to a 5V environment. The Human-body model >2000V LVT16245 and LVTH16245 are fabricated with an Machine model >200V advanced BiCMOS technology to achieve high speed oper- Charged-device >1000V ation similar to 5V ABT while maintaining low power dissi- pation.Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Package Order Number Package Description Number 74LVT16245GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [Tape and Reel] 74LVT16245MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LVT16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) 74LVTH16245GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [Tape and Reel] 74LVTH16245MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300” Wide (Note 2) 74LVTH16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2001 DS500152
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