74LVTH162244MTD ,Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25 Ohm Series Resistors in the OutputsFeaturesThe LVT162244 and LVTH162244 contain sixteen non-
74LVT162244MEA-74LVT162244MEAX-74LVT162244MTD-74LVT162244MTDX-74LVTH162244GX-74LVTH162244MEA-74LVTH162244MEX-74LVTH162244MTD-74LVTH162244MTX
Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25 Ohm Series Resistors in the Outputs
74LVT162244 • 74LVTH162244 Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25Ω Series Resistors in the Outputs March 1999 Revised June 2002 74LVT162244 74LVTH162244 Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25Ω Series Resistors in the Outputs General Description Features The LVT162244 and LVTH162244 contain sixteen non-Input and output interface capability to systems at inverting buffers with 3-STATE outputs designed to be 5V V CC employed as a memory and address driver, clock driver, or Bushold data inputs eliminate the need for external pull- bus oriented transmitter/receiver. The device is nibble con- up resistors to hold unused inputs (74LVTH162244), trolled. Individual 3-STATE control inputs can be shorted also available without bushold feature (74LVT162244). together for 8-bit or 16-bit operation. Live insertion/extraction permitted The LVT162244 and LVTH162244 are designed with Power Up/Power Down high impedance provides glitch- equivalent 25Ω series resistance in both the HIGH and free bus loading LOW states of the output. This design reduces line noise in Outputs include equivalent series resistance of 25Ω to applications such as memory address drivers, clock driv- make external termination resistors unnecessary and ers, and bus transceivers/transmitters. reduce overshoot and undershoot The LVTH162244 data inputs include bushold, eliminating Functionally compatible with the 74 series 162244 the need for external pull-up resistors to hold unused inputs.Latch-up performance exceeds 500 mA These buffers and line drivers are designed for low-voltageESD performance: (3.3V) V applications, but with the capability to provide a CC Human-body model > 2000V TTL interface to a 5V environment. The LVT162244 and Machine model > 200V LVTH162244 are fabricated with an advanced BiCMOS Charged-device > 1000V technology to achieve high speed operation similar to 5V Also packaged in plastic Fine-Pitch Ball Grid Array ABT while maintaining a low power dissipation. (FBGA) Ordering Code: Package Order Number Package Description Number 74LVT162244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) 74LVT162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LVT162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) 74LVTH162244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) 74LVTH162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide [Tube] 74LVTH162244MEX MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide [Tape and Reel] 74LVTH162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide [Tube] 74LVTH162244MTX MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide [Tape and Reel] Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. © 2002 DS012445
