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74LVC1G08GFNXPN/a22500avaiSingle 2-input AND gate
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74LVC1G08GWNXP N/a36035avaiSingle 2-input AND gate


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74LVC1G08GF-74LVC1G08GM-74LVC1G08GV-74LVC1G08GW
Single 2-input AND gate
1. General description
The 74LVC1G08 provides one 2-input AND function.
Inputs can be driven from either 3.3 V or5 V devices. This feature allows the use of these
devices as translators in mixed 3.3 V and5 V applications.
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall
time.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65Vto 5.5V High noise immunity Complies with JEDEC standard: JESD8-7 (1.65Vto 1.95V) JESD8-5 (2.3Vto 2.7V) JESD8-B/JESD36 (2.7Vto 3.6V) 24 mA output drive (VCC =3.0V) CMOS low power consumption Latch-up performance  250 mA Direct interface with TTL levels Inputs accept voltages up to 5V ESD protection: HBM JESD22-A114F exceeds 2000V MM JESD22-A115-A exceeds 200V Multiple package options Specified from 40 C to +85 C and 40 C to +125C
74L VC1G08
Single 2-input AND gate
Rev. 10 — 29 June 2012 Product data sheet
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
3. Ordering information

4. Marking

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram

Table 1. Ordering information

74LVC1G08GW 40 Cto+125C TSSOP5 plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74LVC1G08GV 40 Cto+125C SC-74A plastic surface-mounted package; 5 leads SOT753
74LVC1G08GM 40 Cto+125C XSON6 plastic extremely thin small outline package; leads; 6 terminals; body1 1.45 0.5 mm
SOT886
74LVC1G08GF 40 C to +125 C XSON6 plastic extremely thin small outline package; leads; 6 terminals; body 11 0.5 mm
SOT891
74LVC1G08GN 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 0.9 1.0 0.35 mm
SOT1115
74LVC1G08GS 40 C to +125C XSON6 extremely thin small outline package; no leads; terminals; body 1.0 1.0 0.35 mm
SOT1202
74LVC1G08GX 40 C to +125C X2SON5 X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8 0.8 0.35 mm
SOT1226
Table 2. Marking

74LVC1G08GW VE
74LVC1G08GV V08
74LVC1G08GM VE
74LVC1G08GF VE
74LVC1G08GN VE
74LVC1G08GS VE
74LVC1G08GX VE
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
6. Pinning information
6.1 Pinning

6.2 Pin description

Table 3. Pin description
1 1 data input 2 2 data input
GND 3 3 ground (0V) 4 4 data output
n.c. - 5 not connected
VCC 5 6 supply voltage
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
7. Functional description

[1] H= HIGH voltage level; L= LOW voltage level
8. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC=0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 and X2SON5 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
Table 4. Function table[1]

LLL L L
HHH
Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
VCC supply voltage 0.5 +6.5 V
IIK input clamping current VI < 0 V 50 - mA input voltage [1] 0.5 +6.5 V
IOK output clamping current VO > VCC or VO < 0 V - 50 mA output voltage Active mode [1][2] 0.5 VCC + 0.5 V
Power-down mode [1][2] 0.5 +6.5 V output current VO = 0 V to VCC - 50 mA
ICC supply current - 100 mA
IGND ground current 100 - mA
Ptot total power dissipation Tamb = 40 C to +125C [3]- 250 mW
Tstg storage temperature 65 +150 C
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
9. Recommended operating conditions

10. Static characteristics

Table 6. Recommended operating conditions

VCC supply voltage 1.65 - 5.5 V input voltage 0 - 5.5 V output voltage Active mode 0 - VCC V
VCC = 0 V; Power-down mode 0 - 5.5 V
Tamb ambient temperature 40 - +125 C
t/V input transition rise and fall rate VCC = 1.65 V to 2.7 V - - 20 ns/V
VCC = 2.7 V to 5.5 V - - 10 ns/V
Table 7. Static characteristics

At recommended operating conditions. Voltages are referenced to GND (ground=0V).
VIH HIGH-level
input voltage
VCC = 1.65 V to 1.95 V 0.65VCC - - 0.65VCC -V
VCC = 2.3 V to 2.7 V 1.7 - - 1.7 - V
VCC = 2.7 V to 3.6 V 2.0 - - 2.0 - V
VCC = 4.5 V to 5.5 V 0.7VCC - - 0.7VCC -V
VIL LOW-level
input voltage
VCC = 1.65 V to 1.95 V - - 0.35VCC -0.35VCC V
VCC = 2.3 V to 2.7 V - - 0.7 - 0.7 V
VCC = 2.7 V to 3.6 V - - 0.8 - 0.8 V
VCC = 4.5 V to 5.5 V - - 0.3VCC -0.3VCC V
VOH HIGH-level
output voltage =VIHorVIL= 100 A;
VCC= 1.65V to 5.5V
VCC 0.1 - - VCC 0.1 - V= 4mA; VCC = 1.65V 1.2 - - 0.95 - V= 8mA; VCC = 2.3V 1.9 - - 1.7 - V= 12 mA; VCC = 2.7 V 2.2 - - 1.9 - V= 24 mA; VCC = 3.0 V 2.3 - - 2.0 - V= 32 mA; VCC = 4.5 V 3.8 - - 3.4 - V
VOL LOW-level
output voltage =VIHorVIL =100 A;
VCC= 1.65V to 5.5 V - 0.10 - 0.10 V =4mA; VCC = 1.65V - - 0.45 - 0.70 V =8mA; VCC = 2.3V - - 0.30 - 0.45 V =12mA; VCC = 2.7 V - - 0.40 - 0.60 V =24mA; VCC = 3.0 V - - 0.55 - 0.80 V =32mA; VCC = 4.5 V - - 0.55 - 0.80 V input leakage
current
VI = 5.5 V or GND;
VCC =0Vto 5.5V 0.1 5- 100 A
NXP Semiconductors 74LVC1G08
Single 2-input AND gate

[1] All typical values are measured at VCC=3.3 V and Tamb =25C.
11. Dynamic characteristics

[1] Typical values are measured at Tamb =25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2] tpd is the same as tPLZ and tPZL.
[3] CPD is used to determine the dynamic power dissipation (PDin W). =CPD VCC2fi N+ (CL VCC2fo) where:= input frequency in MHz;= output frequency in MHz;= output load capacitance inpF;
VCC= supply voltage in V;= number of inputs switching;
(CL VCC2fo)= sum of outputs.
IOFF power-off
leakage
current
VCC = 0 V; VIorVO =5.5V - 0.1 10 - 200 A
ICC supply current VI = 5.5 V or GND; IO = 0 A;
VCC= 1.65Vto 5.5 V
-0.1 10 - 200 A
ICC additional
supply current
per pin; VCC = 2.3 V to 5.5 V; =VCC 0.6 V; IO =0 A 5 500 - 5000 A input
capacitance
VCC= 3.3 V; VI = GND to VCC -5- - - pF
Table 7. Static characteristics …continued

At recommended operating conditions. Voltages are referenced to GND (ground=0V).
Table 8. Dynamic characteristics

Voltages are referenced to GND (ground=0 V); for load circuit see Figure9.
tpd propagation delay A, B to Y; see Figure8 [2]
VCC= 1.65 V to 1.95V 1.0 3.4 8.0 1.0 10.5 ns
VCC= 2.3 V to 2.7V 0.5 2.2 5.5 0.5 7.0 ns
VCC= 2.7V 0.5 2.5 5.5 0.5 7.0 ns
VCC= 3.0 V to 3.6V 0.5 2.1 4.5 0.5 6.0 ns
VCC= 4.5 V to 5.5V 0.5 1.7 4.0 0.5 5.5 ns
CPD power dissipation
capacitance
VI = GND to VCC; VCC= 3.3 V [3] -16- - - pF
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
12. AC waveforms

Table 9. Measurement points

1.65 V to 1.95V 0.5VCC 0.5VCC
2.3 V to 2.7V 0.5VCC 0.5VCC
2.7V 1.5V 1.5V
3.0V to 3.6V 1.5V 1.5V
4.5 V to 5.5V 0.5VCC 0.5VCC
NXP Semiconductors 74LVC1G08
Single 2-input AND gate

Table 10. Test data

1.65 V to 1.95V VCC  2.0ns 30pF 1k open
2.3 V to 2.7V VCC  2.0ns 30pF 500 open
2.7V 2.7V  2.5ns 50pF 500 open
3.0V to 3.6V 2.7V  2.5ns 50pF 500 open
4.5 V to 5.5V VCC  2.5ns 50pF 500 open
NXP Semiconductors 74LVC1G08
Single 2-input AND gate
13. Package outline

NXP Semiconductors 74LVC1G08
Single 2-input AND gate

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