74LCXZ16245 ,Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputsapplications.
74LCXZ16245
Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs
74LCXZ16245 Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs March 2002 Revised March 2002 74LCXZ16245 Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs General Description Features The LCXZ16245 contains sixteen non-inverting bidirec-5V tolerant inputs and outputs tional buffers with 3-STATE outputs and is intended for bus2.7V–3.6V V specifications provided CC oriented applications. The device is designed for low volt- 4.5 ns t max (V = 3.3V), 20 μA I max PD CC CC age (2.7V or 3.3V) V applications with capability of inter- CC Power-down high impedance inputs and outputs facing to a 5V signal environment. The device is byte controlled. Each byte has separate control inputs whichSupports live insertion/withdrawal (Note 1) could be shorted together for full 16-bit operation. The T/R ±24 mA output drive (V = 3.0V) CC inputs determine the direction of data flow through the Implements patented noise/EMI reduction circuitry device. The OE inputs disable both the A and B ports by Latch-up performance conforms to the requirements of placing them in a high impedance state. JESD78 When V is between 0V and 1.5V, the LCXZ16245 is on CC ESD performance: the high impedance state during power-up or power-down. This places the outputs in the high impedance (Z) state Human body model > 2000V preventing intermittent low impedance loading or glitching Machine model > 200V in bus oriented applications. Also packaged in plastic Fine-Pitch Ball Grid Array The LCXZ16245 is fabricated with an advanced CMOS (FBGA) (Preliminary) technology to achieve high speed operation while maintain- Note 1: To ensure the high-impedance state during power up or down, OE ing CMOS low power dissipation. should be tied to V through a pull-up resistor: the minimum value or the CC resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Description 74LCXZ16245GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 2) (Preliminary) [TAPE and REEL] 74LCXZ16245MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 2: BGA package available in Tape and Reel only. Logic Symbol © 2002 DS500580
