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74LCXH16244GX-74LCXH16244MEAX-74LCXH16244MTD-74LCXH16244MTDX Fast Delivery,Good Price
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74LCXH16244GXFAIN/a2058avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244MEAXFAIN/a36avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244MTDFSCN/a198avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244MTDFAIN/a500avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244MTDXFAIRCHILDN/a9000avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244MTDXFSCN/a1000avaiLow Voltage 16-Bit Buffer/Line Driver with Bushold


74LCXH16244MTDX ,Low Voltage 16-Bit Buffer/Line Driver with BusholdFeaturesThe LCXH16244 contains sixteen non-inverting buffers

74LCXH16244GX-74LCXH16244MEAX-74LCXH16244MTD-74LCXH16244MTDX
Low Voltage 16-Bit Buffer/Line Driver with Bushold
74LCXH16244 Low Voltage 16-Bit Buffer/Line Driver with Bushold September 2000 Revised June 2002 74LCXH16244 Low Voltage 16-Bit Buffer/Line Driver with Bushold General Description Features The LCXH16244 contains sixteen non-inverting buffers5V tolerant control inputs and outputs with 3-STATE outputs designed to be employed as a mem-2.3V–3.6V V specifications provided CC ory and address driver, clock driver, or bus oriented trans- 4.5 ns t max (V = 3.0V), 20 μA I max PD CC CC mitter/receiver. The device is nibble controlled. Each nibble has separate 3-STATE control inputs which can be shortedBushold on inputs eliminates the need for external together for full 16-bit operation. pull-up/pull-down resistors The LCXH16244 data inputs include active bushold cir-Power down high impedance inputs and outputs cuitry, eliminating the need for external pull-up resistors to±24 mA output drive (V = 3.0V) CC hold unused or floating data inputs at a valid logic level. Implements patented noise/EMI reduction circuitry The LCXH16244 is designed for low voltage (2.5V or 3.3V) Latch-up performance exceeds 500 mA V applications with capability of interfacing to a 5V signal CC ESD performance: environment. Human body model > 2000V The LCXH16244 is fabricated with an advanced CMOS Machine model > 200V technology to achieve high speed operation while maintain- ing CMOS low power dissipation.Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description 74LCXH16244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1)(Note 2) 74LCXH16244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LCXH16244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: Ordering code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2002 DS500248
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