74LCX244MSAX ,Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and OutputsFeaturesThe LCX244 contains eight non-inverting buffers with
74LCX244MSA-74LCX244MSAX-74LCX244MTC-74LCX244MTCX-74LCX244SJ-74LCX244SJX-74LCX244WM-74LCX244WMX
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs
74LCX244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs February 1994 Revised February 2004 74LCX244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs General Description Features The LCX244 contains eight non-inverting buffers with5V tolerant inputs and outputs 3-STATE outputs. The device may be employed as a mem-2.3V to 3.6V V specifications provided CC ory address driver, clock driver and bus-oriented transmit- 6.5 ns t max (V = 3.3V), 10 μA I max PD CC CC ter/receiver. The LCX244 is designed for low voltage (2.5V or 3.3V) V applications with capability of interfacing to aPower down high impedance inputs and outputs CC 5V signal environment.Supports live insertion/withdrawal (Note 1) The LCX244 is fabricated with an advanced CMOS tech-±24 mA output drive (V = 3.0V) CC nology to achieve high speed operation while maintaining Implements patented noise/EMI reduction circuitry CMOS low power dissipation. Latch-up performance exceeds 500 mA ESD performance: Human body model > 2000V Machine model > 200V Leadless DQFN package Note 1: To ensure the high-impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum value or the CC resistor is determined by the current-sourcing capability of the driver. Ordering Code: Package Order Number Package Description Number 74LCX244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide (Note 2) 74LCX244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide (Note 2) 74LCX244BQX MLP020B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, (Note 3) 2.5 x 4.5mm 74LCX244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide (Note 2) 74LCX244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide (Note 2) Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Note 3: DQFN package available in Tape and Reel only. © 2004 DS500107
