74LCX2244 ,Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26-Ohm Series Resistors in the Outputsapplications with capability of interfac-
74LCX2244
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26-Ohm Series Resistors in the Outputs
74LCX2244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26Ω Series Resistors in the Outputs October 1995 Revised March 2001 74LCX2244 Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26Ω Series Resistors in the Outputs General Description Features The LCX2244 contains eight non-inverting buffers with5V tolerant inputs and outputs 3-STATE outputs. The device may be employed as a mem-2.3V–3.6V V specifications provided CC ory address driver, clock driver and bus-oriented transmit- 7.5 ns t max (V = 3.3V) 10 μA I max PD CC CC ter/receiver. The LCX2244 is designed for low voltage (2.5V or 3.3V) V applications with capability of interfac-Power down high impedance inputs and outputs CC ing to a 5V signal environment. The 26Ω series resistors26Ω-series resistors in the outputs help reduce output overshoot and undershoot. Supports live insertion/withdrawal (Note 1) The LCX2244 is fabricated with an advanced CMOS tech-±12 mA output drive (V = 3.0V) CC nology to achieve high speed operation while maintaining Implements patented noise/EMI reduction circuitry CMOS low power dissipation. Latch-up performance exceeds 500 mA ESD performance: Human body model > 2000V Machine model > 200V Note 1: To ensure the high-impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum value or the CC resistor is determined by the current-sourcing capability of the driver. Ordering Code: Order Number Package Number Package Description 74LCX2244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX2244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX2244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LCX2244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol Connection Diagram IEEE/IEC © 2001 DS012569
