74LCX162244MTD ,Low Voltage 16-Bit Buffer/Line Driver with 26 Ohm Series Resistors in OutputsFeaturesThe LCX162244 contains sixteen non-inverting buffers with
74LCX162244MEA-74LCX162244MEAX-74LCX162244MTD-74LCX162244MTDX
Low Voltage 16-Bit Buffer/Line Driver with 26 Ohm Series Resistors in Outputs
74LCX162244 Low Voltage 16-Bit Buffer/Line Driver with 26Ω Series Resistors in Outputs September 2000 Revised August 2001 74LCX162244 Low Voltage 16-Bit Buffer/Line Driver with 26Ω Series Resistors in Outputs General Description Features The LCX162244 contains sixteen non-inverting buffers with5V tolerant inputs and outputs 3-STATE outputs designed to be employed as a memory2.3V–3.6V V specifications provided CC and address driver, clock driver, or bus oriented transmit- Outputs include equivalent series resistance of 26Ω to ter/receiver. The device is nibble controlled. Each nibble make external termination resistors unnecessary and has separate 3-STATE control inputs which can be shorted reduce overshoot and undershoot together for full 16-bit operation. 5.3 ns t max (V = 3.0V), 20 μA I max PD CC CC The LCX162244 is designed for low voltage (2.5V or 3.3V) V applications with capability of interfacing to a 5V signalPower down high impedance inputs and outputs CC environment.±12 mA output drive (V = 3.0V) CC In addition, the outputs include equivalent 26Ω (nominal)Implements patented noise/EMI reduction circuitry series resistors to reduce overshoot and undershoot and Latch-up performance exceeds 500 mA are designed to sink/source up to 12 mA at V = 3.0V. CC ESD performance: The LCX162244 is fabricated with an advanced CMOS Human body model > 2000V technology to achieve high speed operation while maintain- Machine model > 200V ing CMOS low power dissipation. Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) (Preliminary) Ordering Code: Order Number Package Number Package Description 74LCX162244GX BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [TAPE and REEL] 74LCX162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide (Note 2) 74LCX162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) Note 1: BGA package available in Tape and Reel only. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2001 DS500471
