74ABT16244A/74ABTH16244A; 16-bit buffer/line driver (3-State)# Technical Documentation: 74ABTH16244ADGG 16-Bit Buffer/Line Driver with 3-State Outputs
Manufacturer : Philips (PHI)
Component Type : Advanced BiCMOS 16-Bit Buffer/Line Driver
Package : TSSOP-48 (DGG)
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## 1. Application Scenarios
### Typical Use Cases
The 74ABTH16244ADGG serves as a high-performance bidirectional buffer and line driver in digital systems. Key applications include:
- Memory Address/Data Bus Buffering : Provides isolation and signal integrity for microprocessor/microcontroller buses connecting to multiple memory devices (SRAM, DRAM, Flash)
- Backplane Driving : Enables robust signal transmission across backplanes in telecommunications and networking equipment
- I/O Port Expansion : Facilitates additional input/output capabilities in embedded systems
- Hot-Swap Applications : Built-in power-up/power-down protection makes it suitable for live insertion scenarios
- Clock Distribution : Can buffer and distribute clock signals to multiple destinations with minimal skew
### Industry Applications
- Telecommunications : Used in router line cards, switch fabrics, and base station equipment
- Networking Equipment : Ethernet switches, network interface cards, and communication controllers
- Industrial Control Systems : PLCs, motor controllers, and automation equipment
- Computer Systems : Server motherboards, storage area networks, and peripheral controllers
- Automotive Electronics : Infotainment systems and body control modules (with appropriate temperature considerations)
### Practical Advantages and Limitations
Advantages:
- High-Speed Operation : Typical propagation delay of 3.5 ns supports high-frequency systems
- Low Power Consumption : Advanced BiCMOS technology provides TTL compatibility with CMOS power levels
- Bus-Hold Circuitry : Eliminates need for external pull-up/pull-down resistors on data lines
- 3-State Outputs : Allows multiple devices to share common buses
- Live Insertion Capability : Supports hot-swapping without damaging the device or system
- ESD Protection : >2000V HBM protection enhances reliability
Limitations:
- Limited Drive Capability : Maximum 64mA output current may require additional buffering for high-capacitance loads
- Temperature Range : Commercial temperature range (0°C to +70°C) limits use in extreme environments
- Power Sequencing : Requires careful power management in mixed-voltage systems
- Package Density : TSSOP-48 package may be challenging for high-density layouts
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## 2. Design Considerations
### Common Design Pitfalls and Solutions
Power Supply Decoupling:
- Pitfall : Inadequate decoupling causing signal integrity issues and ground bounce
- Solution : Use 0.1μF ceramic capacitors placed within 5mm of each VCC pin, with bulk 10μF capacitors distributed across the board
Signal Integrity:
- Pitfall : Ringing and overshoot on high-speed signals
- Solution : Implement series termination resistors (22-33Ω) close to driver outputs for transmission line matching
Thermal Management:
- Pitfall : Excessive power dissipation in high-frequency applications
- Solution : Ensure adequate airflow and consider thermal vias under the package for heat dissipation
### Compatibility Issues with Other Components
Voltage Level Compatibility:
- Inputs are TTL-compatible but operate with 5V VCC
- Direct interface with 3.3V devices requires level translation
- Outputs can drive both TTL and CMOS inputs
Timing Considerations:
- Clock skew management critical when synchronizing with other logic families
- Setup and hold times must be verified with connected components (processors, FPGAs, etc.)
Mixed-Signal Environments:
- Susceptible to noise from switching power supplies
