OP467AY/883C ,Quad Precision, High Speed Operational AmplifierCHARACTERISTICSOutput Voltage Swing V R = 2 kΩ± 13.0 ±13.5 VO LR = 2 kΩ , –40°C ≤ T ≤ +85°C ±12.9 ± ..
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5962-9325801M2A-OP467AY/883C
Quad Precision, High Speed Operational Amplifier
PIN CONNECTIONS
14-Lead Ceramic DIP (Y Suffix) and
14-Lead Plastic DIP (P Suffix)Quad Precision, High Speed
Operational Amplifier
FEATURES
High Slew Rate – 170 V/�s
Wide Bandwidth – 28 MHz
Fast Settling Time – <200 ns to 0.01%
Low Offset Voltage – <500 �V
Unity-Gain Stable
Low Voltage Operation �5 V to �15 V
Low Supply Current – <10 mA
Drives Capacitive Loads
APPLICATIONS
High Speed Image Display Drivers
High Frequency Active Filters
Fast Instrumentation Amplifiers
High Speed Detectors
Integrators
Photo Diode Preamps
GENERAL DESCRIPTIONThe OP467 is a quad, high speed, precision operational ampli-
fier. It offers the performance of a high speed op amp combined
with the advantages of a precision operational amplifier all in a
single package. The OP467 is an ideal choice for applications
where, traditionally, more than one op amp was used to achieve
this level of speed and precision.
The OP467’s internal compensation ensures stable unity-gain
operation, and it can drive large capacitive loads without oscilla-
tion. With a gain bandwidth product of 28 MHz driving a 30 pF
load, output slew rate in excess of 170 V/µs, and settling time
to 0.01% in less than 200 ns, the OP467 provides excellent
dynamic accuracy in high speed data-acquisition systems. The
channel-to-channel separation is typically 60 dB at 10 MHz.
The dc performance of OP467 includes less than 0.5 mV of
offset, voltage noise density below 6 nV/√Hz, and total supply
current under 10 mA. Common-mode rejection and power
supply rejection ratios are typically 85 dB. PSRR is maintained
to better than 40 dB with input frequencies as high as 1 MHz.
The low offset and drift plus high speed and low noise make the
OP467 usable in applications such as high speed detectors and
instrumentation.
The OP467 is specified for operation from ±5 V to ±15 V over
the extended industrial temperature range (–40°C to +85°C) and
is available in 14-lead plastic and ceramic DIP, and 16-lead
SOIC and 20-terminal LCC surface-mount packages.
Contact your local sales office for MIL-STD-883 data sheet
and availability.
16-Lead SOIC
(S Suffix)Figure 1.Simplified Schematic
20-Terminal LCC
(RC Suffix)
+IN D
+IN C
(TOP VIEW)
+IN A
+IN B
OUT A–IN AOUT D–IN DNC
–IN B
OUT B
–IN C
OUT C
OP467
NC = NO CONNECTREV.E
OP467–SPECIFICATIONS
ELECTRICAL CHARACTERISTICSOUTPUT CHARACTERISTICS
NOISE PERFORMANCE
NOTESLong-Term Offset Voltage Drift is guaranteed by 1000 hrs. Life test performed on three independent wafer lots at 125°C, with an LTPD of 1.3.For proper operation the positive supply must be sequenced ON before the negative supply.
Specifications subject to change without notice.
(@ VS = �15.0 V, TA = 25�C unless otherwise noted.)
ELECTRICAL CHARACTERISTICSDYNAMIC PERFORMANCE
NOISE PERFORMANCE
Specifications subject to change without notice.
(@ VS = �5.0 V, TA = 25�C unless otherwise noted.)
OP467
OP467
WAFER TEST LIMITS1Input Offset Current
Input Voltage Range
Power Supply Rejection Ratio
Large Signal Voltage Gain
NOTESElectrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.Guaranteed by CMR test.
ABSOLUTE MAXIMUM RATINGS1Supply Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Input Voltage3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Differential Input Voltage3 . . . . . . . . . . . . . . . . . . . . . .±26 V
Output Short-Circuit Duration . . . . . . . . . . . . . . . . . .Limited
Storage Temperature Range
Y, RC Packages . . . . . . . . . . . . . . . . . . . .–65°C to +175°C
P, S Packages . . . . . . . . . . . . . . . . . . . . . .–65°C to +150°C
Operating Temperature Range
OP467A . . . . . . . . . . . . . . . . . . . . . . . . . .–55°C to +125°C
OP467G . . . . . . . . . . . . . . . . . . . . . . . . . . .–40°C to +85°C
Junction Temperature Range
Y, RC Packages . . . . . . . . . . . . . . . . . . . .–65°C to +175°C
P, S Packages . . . . . . . . . . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . .300°C
14-Lead Cerdip (Y)
14-Lead PDIP (P)
16-Lead SOIC (S)
NOTESAbsolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.For proper operation the positive supply must be sequenced ON before the
negative supply.For supply voltages less than ±18 V, the absolute maximum input voltage is equal
to the supply voltage.θJA is specified for the worst-case conditions, i.e., θJA is specified for device in socket
for cerdip, P-DIP, and LCC packages; θJA is specified for device soldered in circuit
board for SOIC package.
ORDERING GUIDE
DICE CHARACTERISTICSOP467 Die Size 0.111 � 0.100 inch, 11,100 sq. mils Sub-
strate is Connected to V+, Number of Transistors 165
(@ VS = �15.0 V, TA = 25�C unless otherwise noted.)
TPC 1. Open-Loop Gain, Phase vs. Frequency
TPC 2.Closed-Loop Gain vs. Frequency
TPC 3.Open-Loop Gain vs. Supply Voltage
TPC 4.Closed-Loop Output Impedance vs. Frequency
TPC 5.Gain Linearity vs. Frequency
TPC 6.Max VOUT Swing vs. Frequency
OP467TPC 7.Max VOUT Swing vs. Frequency
TPC 8.Common-Mode Rejection vs. Frequency
TPC 9.Power-Supply Rejection vs. Frequency
TPC 10.Small Signal Overshoot vs. Load Capacitance
TPC 11.Small Signal Overshoot vs. Load Capacitance
TPC 12.Noninverting Gain vs. Capacitive Loads
TPC 13.Channel Separation vs. Frequency
TPC 14.Input Current Noise Density vs. Frequency
TPC 15.Voltage Noise Density vs. Frequency
TPC 16.Settling Time, Negative Edge
TPC 17.Settling Time, Positive Edge
TPC 18.Input Voltage Range vs. Supply Voltage
OP467 TPC 19.Noninverting Gain vs. Supply Voltage
TPC 20.Output Swing vs. Load Resistance
TPC 21.Output Swing vs. Load Resistance
TPC 22.Input Offset Voltage Distribution
TPC 23.Input Offset Voltage Distribution
TPC 24.TC VOS Distribution
TPC 25.TC VOS Distribution
TPC 26.Phase Margin and Gain Bandwidth vs.
Temperature
TPC 27.Slew Rate vs. Temperature
TPC 28.Slew Rate vs. Temperature
TPC 29.Slew Rate vs. Temperature
TPC 30.Slew Rate vs. Temperature
OP467 TPC 31.Settling Time vs. Output Step
TPC 32.Supply Current vs. Supply Voltage
TPC 33.Input Bias Current vs. Temperature
TPC 34.Input Offset Current vs. Temperature