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XPC850SRCZT66BU from FREESCALE

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XPC850SRCZT66BU

Manufacturer: FREESCALE

66MHz; V(ddh): -0.3 to +4V; communication controller

Partnumber Manufacturer Quantity Availability
XPC850SRCZT66BU FREESCALE 320 In Stock

Description and Introduction

66MHz; V(ddh): -0.3 to +4V; communication controller The part **XPC850SRCZT66BU** is manufactured by **Freescale Semiconductor**. Below are its key specifications, descriptions, and features:  

### **Specifications:**  
- **Manufacturer:** Freescale Semiconductor  
- **Core Processor:** PowerPC 8xx  
- **Core:** MPC8xx  
- **Speed:** 66 MHz  
- **Package:** 256-PBGA (27x27)  
- **Operating Temperature:** -40°C to 105°C  
- **Voltage - I/O:** 3.3V  
- **RAM Controllers:** DRAM, SRAM  
- **USB:** No  
- **Ethernet:** No  
- **Number of Cores/Bus Width:** 1 Core, 32-Bit  
- **Graphics Acceleration:** No  
- **Additional Interfaces:** I²C, SPI, UART, HDLC  

### **Descriptions & Features:**  
- **Embedded Processor:** Designed for embedded applications requiring low power consumption and high performance.  
- **On-Chip Peripherals:** Includes timers, DMA controllers, and serial communication interfaces.  
- **Memory Support:** Supports external DRAM and SRAM with integrated memory controllers.  
- **Industrial & Automotive Use:** Suitable for harsh environments due to its wide operating temperature range.  
- **Low-Power Design:** Optimized for power-sensitive applications.  

This part is commonly used in industrial control systems, telecommunications, and automotive electronics.  

Let me know if you need further details.

Application Scenarios & Design Considerations

66MHz; V(ddh): -0.3 to +4V; communication controller
Partnumber Manufacturer Quantity Availability
XPC850SRCZT66BU MOTOROLA 84 In Stock

Description and Introduction

66MHz; V(ddh): -0.3 to +4V; communication controller The **XPC850SRCZT66BU** is a microprocessor manufactured by **Motorola**. Below are its key specifications, descriptions, and features:

### **Specifications:**
- **Manufacturer:** Motorola  
- **Core Processor:** PowerPC 8xx  
- **Core Frequency:** 66 MHz  
- **Data Bus Width:** 32-bit  
- **Address Bus Width:** 32-bit  
- **Voltage Supply:** 3.3V  
- **Operating Temperature:** -40°C to +85°C (Industrial)  
- **Package:** 256-Pin PBGA (Plastic Ball Grid Array)  
- **On-Chip Cache:** 4 KB Instruction Cache, 2 KB Data Cache  
- **Bus Interface:** 60x-compatible bus  

### **Descriptions and Features:**
- Based on the **PowerPC 8xx** architecture.  
- Integrates a **RISC (Reduced Instruction Set Computing)** processor core.  
- Includes an **MMU (Memory Management Unit)** for virtual memory support.  
- Features an **integrated communications processor** for networking applications.  
- Supports **big-endian** byte ordering.  
- Includes **timers, DMA controllers, and interrupt controllers** for embedded applications.  
- Designed for **industrial and telecommunications** applications.  
- Low-power consumption suitable for embedded systems.  

This microprocessor is commonly used in **networking equipment, industrial control systems, and telecommunications infrastructure**.  

(Note: This information is based on available technical documentation; always refer to the official datasheet for precise details.)

Application Scenarios & Design Considerations

66MHz; V(ddh): -0.3 to +4V; communication controller
Partnumber Manufacturer Quantity Availability
XPC850SRCZT66BU FREESCAL 22 In Stock

Description and Introduction

66MHz; V(ddh): -0.3 to +4V; communication controller The **XPC850SRCZT66BU** is a microprocessor manufactured by **Freescale Semiconductor** (now part of NXP Semiconductors). Below are the factual specifications, descriptions, and features based on available technical documentation:

### **Specifications:**
1. **Manufacturer:** Freescale Semiconductor  
2. **Series:** PowerPC 8xx  
3. **Core Processor:** PowerPC 8xx  
4. **Core Architecture:** 32-bit  
5. **Clock Speed:** 66 MHz  
6. **Data Bus Width:** 32-bit  
7. **Address Bus Width:** 32-bit  
8. **Operating Temperature Range:** Industrial (-40°C to +85°C)  
9. **Package:** 256-Pin TBGA (Thermal Ball Grid Array)  
10. **Voltage Supply:** 3.3V  
11. **On-Chip Cache:**  
   - Instruction Cache: 4 KB  
   - Data Cache: 4 KB  
12. **Integrated Peripherals:**  
   - Memory Management Unit (MMU)  
   - System Interface Unit (SIU)  
   - Communications Processor Module (CPM)  
   - Timers, UARTs, I²C, SPI  

### **Descriptions & Features:**
- **Embedded Processor:** Designed for embedded applications requiring high performance and low power consumption.  
- **PowerPC Core:** Based on the PowerPC architecture, optimized for real-time control and communications.  
- **Integrated CPM:** Includes a Communications Processor Module supporting multiple protocols (Ethernet, HDLC, UART, etc.).  
- **Industrial-Grade:** Suitable for harsh environments with extended temperature support.  
- **Low Power Modes:** Features power-saving modes for energy efficiency.  
- **Application Use Cases:** Networking equipment, industrial automation, telecommunications, and automotive systems.  

This information is sourced from Freescale/NXP datasheets and technical documentation. For detailed electrical characteristics, refer to the official **XPC850SRCZT66BU datasheet**.

Application Scenarios & Design Considerations

66MHz; V(ddh): -0.3 to +4V; communication controller

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