IC Phoenix logo

Home ›  X  › X10 > XCV1000-4FG680C

XCV1000-4FG680C from XILINX

Fast Delivery, Competitive Price @IC-phoenix

If you need more electronic components or better pricing, we welcome any inquiry.

0.000ms

XCV1000-4FG680C

Manufacturer: XILINX

Virtex 2.5V field programmable gate array.

Partnumber Manufacturer Quantity Availability
XCV1000-4FG680C,XCV10004FG680C XILINX 75 In Stock

Description and Introduction

Virtex 2.5V field programmable gate array. The **XCV1000-4FG680C** is a high-performance FPGA (Field-Programmable Gate Array) manufactured by **Xilinx**. Below are its key specifications, descriptions, and features based on factual information:  

### **Specifications:**  
- **Manufacturer:** Xilinx  
- **Family:** Virtex®  
- **Series:** Virtex-E  
- **Part Number:** XCV1000-4FG680C  
- **Device Type:** FPGA  
- **Logic Elements/Cells:** 1,000,000 gates (approximate)  
- **Number of Logic Blocks (CLBs):** 12,288  
- **Number of I/O Pins:** 404  
- **Operating Voltage:** 1.8V (Core), 3.3V (I/O)  
- **Speed Grade:** -4 (indicating performance level)  
- **Package Type:** 680-pin Fine-Pitch Ball Grid Array (FG680)  
- **Operating Temperature Range:** Commercial (0°C to +85°C)  
- **On-Chip RAM:** 1,152 Kbits (distributed and block RAM)  
- **Maximum Frequency:** Varies based on design (dependent on configuration)  

### **Descriptions & Features:**  
- **High-Density FPGA:** Designed for complex digital logic applications requiring high gate count and performance.  
- **Advanced Architecture:** Built on Xilinx Virtex-E architecture, optimized for speed and flexibility.  
- **Flexible I/O Support:** Supports multiple I/O standards (LVTTL, LVCMOS, PCI, etc.).  
- **On-Chip Memory:** Includes block RAM and distributed RAM for efficient data storage.  
- **Dedicated Clock Management:** Features Digital Clock Managers (DCMs) for precise clock control.  
- **Reconfigurable Logic:** Allows dynamic reprogramming for various applications.  
- **High-Speed Interfaces:** Suitable for high-speed data processing and communication systems.  
- **Fine-Pitch BGA Package:** Ensures compact PCB integration with high pin density.  

This FPGA is commonly used in applications such as **telecommunications, networking, DSP (Digital Signal Processing), and high-performance computing**.  

(Note: Specifications may vary slightly based on datasheet revisions. Always refer to official Xilinx documentation for exact details.)

Request Quotation

For immediate assistance, call us at +86 533 2716050 or email [email protected]

Part Number Quantity Target Price($USD) Email Contact Person
We offer highly competitive channel pricing. Get in touch for details.

Specializes in hard-to-find components chips