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V53C16258HT40 from MOSEL

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V53C16258HT40

Manufacturer: MOSEL

HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH

Partnumber Manufacturer Quantity Availability
V53C16258HT40 MOSEL 610 In Stock

Description and Introduction

HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH The part **V53C16258HT40** is a **4M x 16-bit (64Mb) CMOS DRAM** manufactured by **MOSEL**.  

### **Specifications:**  
- **Organization:** 4M x 16-bit  
- **Density:** 64 Megabit (64Mb)  
- **Voltage Supply:** 3.3V  
- **Access Time:** 40ns  
- **Package:** TSOP (Thin Small Outline Package)  
- **Technology:** CMOS  
- **Refresh:** 4K refresh cycles every 64ms  
- **Operating Temperature Range:** Commercial (0°C to +70°C)  

### **Descriptions and Features:**  
- **High-Speed Operation:** Supports fast access times for improved performance.  
- **Low Power Consumption:** Optimized for power efficiency in 3.3V systems.  
- **Synchronous Interface:** Compatible with high-speed memory systems.  
- **Wide Data Bus:** 16-bit organization for efficient data transfer.  
- **Industrial Standard Pinout:** Ensures compatibility with standard memory modules.  

This DRAM is designed for applications requiring high-density, high-speed memory, such as networking, computing, and embedded systems.

Partnumber Manufacturer Quantity Availability
V53C16258HT40 1000 In Stock

Description and Introduction

HIGH PERFORMANCE 256K X 16 EDO PAGE MODE CMOS DYNAMIC RAM OPTIONAL SELF REFRESH The part **V53C16258HT40** is a **4M x 16-bit (64Mb) CMOS Dynamic RAM (DRAM)**. Below are the key specifications, descriptions, and features based on the available knowledge:  

### **Manufacturer:**  
- **V53C16258HT40** is manufactured by **Mosel Vitelic Corporation** (now part of **ProMOS Technologies**).  

### **Specifications:**  
- **Organization:** 4,194,304 words × 16 bits (4M × 16)  
- **Density:** 64 Megabits (64Mb)  
- **Technology:** CMOS DRAM  
- **Voltage Supply:** **3.3V ± 0.3V**  
- **Access Time:** **40ns** (as indicated by "HT40")  
- **Package Type:** Typically **TSOP (Thin Small Outline Package)** or similar surface-mount package  
- **Refresh:** **4,096 refresh cycles every 64ms** (standard DRAM refresh requirement)  
- **Operating Temperature:** Commercial (0°C to +70°C) or Industrial (-40°C to +85°C), depending on variant  

### **Features:**  
- **Synchronous Interface:** Supports synchronous operation (if applicable, though some variants may be asynchronous)  
- **Low Power Consumption:** CMOS technology ensures lower power usage  
- **High-Speed Operation:** 40ns access time for fast data retrieval  
- **Wide Data Bus:** 16-bit organization for broader data transfer  
- **Auto & Self Refresh:** Supports standard DRAM refresh modes  

### **Applications:**  
- Used in **PC memory modules**, embedded systems, networking devices, and other applications requiring moderate-speed DRAM.  

This information is based on standard specifications for similar DRAM chips from the same manufacturer. For exact details, refer to the official datasheet.

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