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SN74LS51NSR from TEXAS

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SN74LS51NSR

Manufacturer: TEXAS, TI, TI

Dual 2-wide 2-input and 3-input AND-NOR gates

Partnumber Manufacturer Quantity Availability
SN74LS51NSR TEXAS, TI, TI 2714 In Stock

Description and Introduction

Dual 2-wide 2-input and 3-input AND-NOR gates The SN74LS51NSR is a TTL (Transistor-Transistor Logic) device manufactured by Texas Instruments (TI).  

### **Specifications:**  
- **Logic Type:** AND-OR-Invert (AOI) Gate  
- **Number of Gates:** 2  
- **Number of Inputs:** 4 (per gate)  
- **Supply Voltage (VCC):** 4.75V to 5.25V  
- **Operating Temperature Range:** 0°C to 70°C  
- **Package:** SOIC (Small Outline Integrated Circuit)  
- **Mounting Type:** Surface Mount  
- **Propagation Delay:** Typically 15ns  
- **Power Dissipation:** Low power Schottky (LS) technology  

### **Descriptions:**  
The SN74LS51NSR is a dual 2-wide, 2-input AND-OR-Invert (AOI) gate. It performs the Boolean function (A·B + C·D)' in each of its two independent gates.  

### **Features:**  
- **Low Power Consumption:** Uses Schottky technology for reduced power dissipation.  
- **High Speed:** Fast switching with a typical propagation delay of 15ns.  
- **Wide Operating Voltage:** Compatible with standard TTL levels.  
- **Surface-Mount Package:** SOIC package for compact PCB designs.  
- **Reliable Performance:** Designed for industrial and commercial applications.  

This information is based solely on the manufacturer's datasheet.

Application Scenarios & Design Considerations

Dual 2-wide 2-input and 3-input AND-NOR gates

Alternative Part Number

  • DM74LS51N --: Same 74LS51 dual AND-OR-INVERT logic function in a DIP package, pin-compatible logic equivalent from a different series prefix.
  • MC74LS51N --: Direct functional equivalent of the 74LS51 dual AND-OR-INVERT gate, widely available and electrically compatible.
  • SN74LS51N --: Same TI 74LS51 logic device in a through-hole DIP package, suitable when the SOIC package of the original is not required.
  • SN74LS51D --: Identical 74LS51 logic function from the same manufacturer in an SOIC package, suitable when the SOIC footprint matches the board layout.

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