Enhanced Product Floating-Point Digital Signal Processor 272-BGA -55 to 125 The SM32C6713BGDPM30EP is a digital signal processor (DSP) manufactured by Texas Instruments (TI). Below are the specifications, descriptions, and features based on Ic-phoenix technical data files:
### **Specifications:**
- **Manufacturer:** Texas Instruments (TI)
- **Part Number:** SM32C6713BGDPM30EP
- **Core Processor:** TMS320C67x DSP
- **Core Architecture:** VLIW (Very Long Instruction Word)
- **Clock Speed:** 300 MHz
- **Instruction Set:** Floating-Point & Fixed-Point
- **Data Bus Width:** 32-bit
- **Operating Temperature Range:** -55°C to +125°C (Military Grade)
- **Package:** 272-BGA (Ball Grid Array)
- **Supply Voltage:** 1.26V (Core), 3.3V (I/O)
- **On-Chip RAM:** 264 KB
- **On-Chip ROM:** 8 KB
- **External Memory Interface:** Supports SDRAM, SRAM, Flash
- **I/O Voltage:** 3.3V
- **Number of DMA Channels:** 16
- **Timers:** 2x 32-bit
- **Serial Interfaces:** McBSP (Multichannel Buffered Serial Port), I²C, SPI
- **Special Features:** Enhanced Direct Memory Access (EDMA), Power Management
### **Descriptions:**
The SM32C6713BGDPM30EP is a high-performance floating-point DSP from TI's TMS320C67x family. It is designed for demanding applications in military, aerospace, and industrial environments due to its extended temperature range and ruggedized packaging.
### **Features:**
- High-speed 300 MHz DSP core with VLIW architecture
- Supports both floating-point and fixed-point operations
- Large on-chip memory for efficient data processing
- Multiple high-speed serial interfaces (McBSP, I²C, SPI)
- Robust external memory interface for expanded storage
- Enhanced DMA for efficient data transfers
- Low-power modes for energy-sensitive applications
- Radiation-hardened and military-grade reliability
This DSP is commonly used in radar, sonar, medical imaging, and other high-performance signal processing applications.
(Note: All details are based on available technical documentation; always verify with the latest datasheet from TI.)
