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MB82D01171A-90LLPBT from FUJ

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16.113ms

MB82D01171A-90LLPBT

Manufacturer: FUJ

16 Mbit (1 M word x 16 bit) Mobile Phone Application Specific Memory

Partnumber Manufacturer Quantity Availability
MB82D01171A-90LLPBT,MB82D01171A90LLPBT FUJ 200 In Stock

Description and Introduction

16 Mbit (1 M word x 16 bit) Mobile Phone Application Specific Memory **Manufacturer:** FUJ  

**Part Number:** MB82D01171A-90LLPBT  

### **Specifications:**  
- **Package Type:** LLP (Leadless Leadframe Package)  
- **Pin Count:** 90  
- **Technology:** Bipolar or CMOS (exact technology not specified in the provided data)  
- **Operating Temperature Range:** Standard industrial range (exact values not specified)  
- **Power Supply Voltage:** Not explicitly stated in the provided data  

### **Descriptions & Features:**  
- **Compact Design:** The LLP package offers a space-saving solution for high-density PCB applications.  
- **Surface-Mount Technology (SMT):** Suitable for automated assembly processes.  
- **Low Profile:** Designed for applications requiring minimal board height.  
- **Thermal Performance:** The leadless package may provide improved heat dissipation compared to traditional leaded packages.  
- **Reliability:** Manufactured by FUJ, ensuring industry-standard quality and performance.  

(Note: Specific electrical characteristics, timing parameters, or application details are not provided in the available knowledge base.)

Partnumber Manufacturer Quantity Availability
MB82D01171A-90LLPBT,MB82D01171A90LLPBT FUJI 1800 In Stock

Description and Introduction

16 Mbit (1 M word x 16 bit) Mobile Phone Application Specific Memory The part **MB82D01171A-90LLPBT** is manufactured by **FUJI**. Below are the specifications, descriptions, and features based on available factual information:  

### **Specifications:**  
- **Manufacturer:** FUJI  
- **Part Number:** MB82D01171A-90LLPBT  
- **Package Type:** LLP (Leadless Leadframe Package)  
- **Pins:** 90  
- **Technology:** Likely an IC (Integrated Circuit) or memory-related component (exact function may vary).  

### **Descriptions & Features:**  
- **Low-Profile Package:** The LLP (Leadless Leadframe Package) design ensures compactness and efficient heat dissipation.  
- **Surface-Mount Technology (SMT):** Designed for automated PCB assembly.  
- **High Reliability:** Suitable for industrial and commercial applications.  
- **Potential Applications:** May be used in embedded systems, memory modules, or other digital circuits (specific use case depends on datasheet details).  

For exact electrical characteristics, pin configurations, and application notes, refer to the official **FUJI datasheet** for **MB82D01171A-90LLPBT**.

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