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MAX6656MEE from MAXIM,MAXIM - Dallas Semiconductor

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MAX6656MEE

Manufacturer: MAXIM

PLASTIC ENCAPSULATED DEVICES

Partnumber Manufacturer Quantity Availability
MAX6656MEE MAXIM 3692 In Stock

Description and Introduction

PLASTIC ENCAPSULATED DEVICES The MAX6656MEE is a temperature sensor and fan-speed controller manufactured by Maxim Integrated (now part of Analog Devices). Below are its key specifications, descriptions, and features based on factual information:

### **Specifications:**  
- **Manufacturer:** Maxim Integrated (now Analog Devices)  
- **Part Number:** MAX6656MEE  
- **Package:** 16-QSOP (QSOP-16)  
- **Operating Voltage:** 3.0V to 5.5V  
- **Temperature Measurement Range:** -55°C to +125°C  
- **Accuracy:** ±1°C (typical) from +60°C to +100°C  
- **Temperature Resolution:** 1°C  
- **Fan Control:** PWM output for fan-speed regulation  
- **Interface:** I²C/SMBus-compatible  
- **Programmable Alert Function:** Overtemperature alarm  
- **Programmable Fan Speed Control:** Based on temperature thresholds  
- **Supply Current:** 1mA (typical)  

### **Descriptions:**  
The MAX6656MEE is a high-precision digital temperature sensor with an integrated fan-speed controller. It monitors the temperature of a remote diode-connected transistor (e.g., CPU diode) or its own internal sensor and adjusts fan speed via PWM output to maintain optimal thermal conditions. It communicates with a host system via the I²C/SMBus interface.  

### **Features:**  
- **Dual Temperature Monitoring:** Measures remote diode (e.g., CPU) and internal temperature.  
- **PWM Fan Control:** Adjusts fan speed based on temperature readings.  
- **Programmable Thresholds:** User-configurable temperature limits for fan control and alarms.  
- **SMBus/I²C Interface:** Allows communication with a microcontroller or host system.  
- **Overtemperature Alarm:** Configurable alert output for critical conditions.  
- **Low Power Consumption:** Suitable for battery-powered or energy-efficient systems.  
- **Compact Package:** 16-QSOP for space-constrained applications.  

This information is strictly based on the manufacturer's datasheet and technical documentation.

Application Scenarios & Design Considerations

PLASTIC ENCAPSULATED DEVICES

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