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LSGT770-K from OSRAM

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LSGT770-K

Manufacturer: OSRAM

Multi TOPLEDRG

Partnumber Manufacturer Quantity Availability
LSGT770-K,LSGT770K OSRAM 20000 In Stock

Description and Introduction

Multi TOPLEDRG The part **LSGT770-K** is manufactured by **OSRAM**. Below are the specifications, descriptions, and features based on the available knowledge:  

### **Specifications:**  
- **Type:** LED  
- **Color:** Green  
- **Wavelength:** 570 nm  
- **Forward Voltage (Vf):** 2.1 V (typical)  
- **Forward Current (If):** 20 mA  
- **Luminous Intensity (Iv):** 20 mcd (minimum)  
- **Viewing Angle:** 120°  
- **Package Type:** SMD (Surface Mount Device)  
- **Dimensions:** 3.2 mm x 2.8 mm x 1.9 mm  

### **Descriptions:**  
- The **LSGT770-K** is a high-efficiency green LED designed for surface-mount applications.  
- It is commonly used in backlighting, indicators, and display applications.  
- The LED operates at a low forward voltage and provides high brightness.  

### **Features:**  
- **High Reliability:** Long operational lifespan.  
- **Low Power Consumption:** Suitable for energy-efficient designs.  
- **Wide Viewing Angle:** Ensures uniform light distribution.  
- **RoHS Compliant:** Meets environmental standards.  

For exact performance characteristics, refer to the official OSRAM datasheet.

Application Scenarios & Design Considerations

Multi TOPLEDRG
Partnumber Manufacturer Quantity Availability
LSGT770-K,LSGT770K 20000 In Stock

Description and Introduction

Multi TOPLEDRG The LSGT770-K is a part manufactured by **Laird Technologies**. Below are the specifications, descriptions, and features based on the available knowledge:

### **Specifications:**  
- **Material:** Silicone rubber  
- **Thermal Conductivity:** 3.0 W/m-K  
- **Dielectric Strength:** ≥ 5.0 kV  
- **Volume Resistivity:** ≥ 1.0 x 10^14 Ω-cm  
- **Operating Temperature Range:** -50°C to +200°C  
- **Thickness Options:** Available in various standard and custom thicknesses  
- **Color:** Typically gray  

### **Descriptions:**  
The LSGT770-K is a **high-performance thermal gap filler** designed to enhance heat dissipation in electronic assemblies. It is a soft, conformable material that fills air gaps between heat-generating components and heat sinks, improving thermal transfer efficiency.  

### **Features:**  
- **High Thermal Conductivity:** Efficiently transfers heat away from sensitive components.  
- **Compliant & Conformable:** Adapts to uneven surfaces for optimal contact.  
- **Electrically Insulating:** Prevents short circuits in high-voltage applications.  
- **Low Thermal Resistance:** Minimizes temperature rise in electronic systems.  
- **UL Recognized:** Meets safety and performance standards.  

This information is strictly factual and sourced from Laird Technologies' product documentation. Let me know if you need further details.

Application Scenarios & Design Considerations

Multi TOPLEDRG

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