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LQH32CH220K23L from MURATA

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LQH32CH220K23L

Manufacturer: MURATA

Chip Inductor for Automotive (Chip Coil for Automotive) Power Inductor (Wire Wound Type for Choke)

Partnumber Manufacturer Quantity Availability
LQH32CH220K23L MURATA 2000 In Stock

Description and Introduction

Chip Inductor for Automotive (Chip Coil for Automotive) Power Inductor (Wire Wound Type for Choke) The **LQH32CH220K23L** is a multilayer ceramic inductor manufactured by **Murata**.  

### **Specifications:**  
- **Inductance:** 22 µH  
- **Tolerance:** ±10%  
- **DC Resistance (DCR):** 1.5 Ω (max)  
- **Rated Current:** 100 mA  
- **Self-Resonant Frequency (SRF):** 8 MHz (min)  
- **Operating Temperature Range:** -40°C to +85°C  
- **Package Size:** 3.2 mm × 2.5 mm × 2.0 mm (L × W × H)  

### **Descriptions & Features:**  
- **Type:** Wire-wound multilayer ceramic inductor  
- **Material:** Ferrite-based  
- **Applications:** Used in power supply circuits, DC-DC converters, noise suppression, and RF circuits  
- **Features:** High inductance in a compact size, stable performance over temperature, and low DC resistance  

This inductor is designed for surface-mount (SMD) applications and is part of Murata's **LQH32C** series.

Application Scenarios & Design Considerations

Chip Inductor for Automotive (Chip Coil for Automotive) Power Inductor (Wire Wound Type for Choke) # Technical Document: LQH32CH220K23L Inductor

 Manufacturer:  MURATA  
 Component Type:  Multilayer Chip Inductor (Ferrite-based, High-Frequency)  
 Series:  LQH32C Series

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## 1. Application Scenarios

### 1.1 Typical Use Cases
The LQH32CH220K23L is a 22 µH (±10%) multilayer chip inductor designed for high-frequency filtering, impedance matching, and energy storage in compact electronic circuits. Its primary function is to suppress electromagnetic interference (EMI) and provide stable inductance in high-frequency AC signal paths.

 Key Use Cases Include: 
-  Power Supply Filtering:  Used in DC-DC converter output stages (particularly buck/boost converters) to smooth switching ripple currents. Commonly paired with ceramic capacitors in LC filter networks.
-  RF Impedance Matching:  Essential in RF front-end modules (FEMs) for impedance transformation between antenna and transceiver ICs (e.g., in Bluetooth, Wi-Fi, and cellular modules).
-  Signal Line Choking:  Prevents high-frequency noise from propagating along power or signal lines in mixed-signal systems (e.g., between digital processors and analog sensors).
-  Resonant Circuits:  Forms part of resonant tank circuits in voltage-controlled oscillators (VCOs) and RF matching networks.

### 1.2 Industry Applications
-  Consumer Electronics:  Smartphones, tablets, wearables, and IoT devices for power management and RF communication.
-  Telecommunications:  Baseband units, small-cell equipment, and RF transceivers requiring stable inductance up to several hundred MHz.
-  Automotive Electronics:  Infotainment systems, ADAS sensors, and engine control units (ECUs) where temperature stability and reliability are critical.
-  Industrial Electronics:  PLCs, motor drives, and instrumentation equipment for noise suppression in harsh environments.

### 1.3 Practical Advantages and Limitations
 Advantages: 
-  Miniaturization:  1210 package size (3.2 mm × 2.5 mm) enables high-density PCB designs.
-  High-Frequency Performance:  Ferrite material maintains stable inductance up to self-resonant frequency (SRF ~30 MHz typical for 22 µH).
-  Temperature Resilience:  Operating temperature range of -40°C to +85°C (extended options available) with low inductance drift.
-  RoHS Compliance:  Lead-free construction suitable for modern environmental standards.

 Limitations: 
-  Saturation Current:  Rated at 180 mA (Isat) – unsuitable for high-current power paths (>200 mA).
-  Self-Resonant Frequency (SRF):  Above SRF, the component behaves capacitively, limiting usable frequency range.
-  Mechanical Fragility:  Multilayer ceramic construction is susceptible to cracking under mechanical stress or thermal shock.

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## 2. Design Considerations

### 2.1 Common Design Pitfalls and Solutions
| Pitfall | Consequence | Solution |
|---------|-------------|----------|
|  Exceeding Isat  | Inductance drops sharply, causing filter failure | Calculate peak current in application; select inductor with Isat ≥ 1.3× peak current |
|  Operating near SRF  | Loss of inductive behavior, increased insertion loss | Ensure operating frequency < 80% of SRF; verify with network analyzer measurements |
|  Thermal Stress Cracking  | Inductor fracture during reflow or board flexure | Follow Murata’s reflow profile; avoid placing near board edges or mounting screws |
|  DC Bias Dependency  | Inductance decreases with DC current flow | Use inductance vs. DC bias curves from datasheet; derate inductance by 20-30% |

### 2.2 Compatibility Issues with Other Components
-  Capacitors

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