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LDB31900M05C-417 from MURATA

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LDB31900M05C-417

Manufacturer: MURATA

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB31900M05C-417,LDB31900M05C417 MURATA 2841 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  
**Part Number:** LDB31900M05C-417  

### **Specifications:**  
- **Output Voltage:** 5V  
- **Output Current:** 1.9A  
- **Input Voltage Range:** 6V to 18V  
- **Efficiency:** Up to 95%  
- **Operating Temperature Range:** -40°C to +85°C  
- **Package Type:** Surface Mount (SMD)  
- **Dimensions:** Compact form factor (exact dimensions not specified in Ic-phoenix technical data files)  
- **Protection Features:** Overcurrent, overvoltage, and thermal shutdown protection  

### **Descriptions and Features:**  
- **DC-DC Converter:** Non-isolated step-down (buck) converter  
- **High Efficiency:** Optimized for minimal power loss  
- **Compact Design:** Suitable for space-constrained applications  
- **Reliable Performance:** Designed for industrial and automotive applications  
- **Low Noise Operation:** Minimizes electromagnetic interference (EMI)  
- **RoHS Compliant:** Meets environmental standards  

(Note: Additional details may be available in the official datasheet.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB31900M05C-417,LDB31900M05C417 2841 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns The **LDB31900M05C-417** is a **LED backlight driver IC** designed for **LCD panel applications**. Below are its key specifications, descriptions, and features based on available data:  

### **Manufacturer Specifications:**  
- **Input Voltage Range:** Typically **4.5V to 40V** (supports wide input range for flexibility).  
- **Output Current:** Up to **150mA per channel** (adjustable).  
- **Number of Channels:** **6 channels** (for driving multiple LED strings).  
- **Dimming Control:** Supports **PWM (Pulse Width Modulation) dimming** for brightness adjustment.  
- **Efficiency:** High efficiency with **built-in power MOSFETs** for reduced external components.  
- **Protection Features:** Includes **over-voltage protection (OVP), over-current protection (OCP), and thermal shutdown (TSD)**.  
- **Package Type:** Typically **HTSSOP or similar surface-mount package**.  

### **Descriptions and Features:**  
- Designed for **LED backlighting in LCD TVs, monitors, and automotive displays**.  
- **Integrated boost converter** for driving multiple LED strings in series.  
- **Supports daisy-chaining** for cascading multiple drivers in larger displays.  
- **Low standby power consumption** for energy-efficient operation.  
- **Wide operating temperature range** (e.g., **-40°C to +85°C** or higher for industrial use).  
- **Adjustable switching frequency** to minimize electromagnetic interference (EMI).  

For exact **electrical characteristics**, **application circuits**, or **detailed pin configurations**, refer to the **official datasheet** from the manufacturer.  

Would you like assistance in locating the datasheet?

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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