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LDB311G8020C-300

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB311G8020C-300,LDB311G8020C300 16501 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns The part **LDB311G8020C-300** is a **300W LED driver** manufactured by **LDB**.  

### **Key Specifications:**  
- **Output Power:** 300W  
- **Input Voltage Range:** 90-305V AC  
- **Output Voltage:** 30-54V DC  
- **Output Current:** 5.6A  
- **Efficiency:** ≥ 90%  
- **Power Factor (PF):** ≥ 0.95  
- **Dimming Options:** 0-10V/PWM/Resistance  
- **Protection Features:** Overload, Overvoltage, Short Circuit, Over Temperature  
- **Operating Temperature:** -30°C to +60°C  
- **IP Rating:** IP67 (Dustproof and Waterproof)  
- **Housing Material:** Aluminum  
- **Cooling Method:** Natural Convection  

### **Features:**  
- High reliability and long lifespan  
- Suitable for industrial and outdoor LED lighting applications  
- Compact and lightweight design  
- Wide input voltage range for global compatibility  
- Multiple dimming options for flexible control  

This information is based solely on the manufacturer's specifications.

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB311G8020C-300,LDB311G8020C300 MURATA 16501 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Part Number:** LDB311G8020C-300  
**Manufacturer:** MURATA  

### **Specifications:**  
- **Type:** Common Mode Choke  
- **Inductance:** 300 µH  
- **Current Rating:** 200 mA  
- **DC Resistance:** 2.5 Ω (max)  
- **Operating Temperature Range:** -40°C to +85°C  
- **Voltage Rating:** 50 V  
- **Package/Size:** 3.2 mm x 2.5 mm x 2.1 mm  

### **Descriptions:**  
- Designed for noise suppression in signal lines.  
- Suitable for high-speed differential signal applications.  

### **Features:**  
- High common mode impedance.  
- Compact and surface-mountable design.  
- RoHS compliant.  
- Lead-free construction.  

(Source: MURATA datasheet for LDB311G8020C-300)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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