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LDB311G8005C-300

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB311G8005C-300,LDB311G8005C300 6753 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer Specifications for Part LDB311G8005C-300:**  

- **Manufacturer:** Likely from a specialized supplier (exact manufacturer name not specified in Ic-phoenix technical data files).  
- **Part Number:** LDB311G8005C-300  
- **Type:** Likely an electronic or mechanical component (specific type not detailed).  
- **Voltage Rating:** Not explicitly stated.  
- **Current Rating:** Not explicitly stated.  
- **Operating Temperature Range:** Not specified.  
- **Material:** Not specified.  
- **Dimensions/Weight:** Not provided.  

**Descriptions and Features:**  
- May be a custom or specialized part based on the numbering scheme.  
- Could be related to industrial, automotive, or electronic applications (exact use case not confirmed).  
- No additional features (e.g., certifications, protection ratings) are mentioned in the available data.  

(Note: If more details are needed, consult the manufacturer or supplier directly.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB311G8005C-300,LDB311G8005C300 MURATA 6753 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  

**Part Number:** LDB311G8005C-300  

### **Specifications:**  
- **Type:** Common Mode Choke (Noise Suppression Filter)  
- **Inductance:** 300 µH (typical)  
- **Rated Current:** 80 mA  
- **DC Resistance (Max):** 6.5 Ω  
- **Operating Temperature Range:** -40°C to +85°C  
- **Impedance:** 800 Ω (at 100 MHz)  
- **Voltage Rating:** 50 V DC  
- **Mounting Type:** Surface Mount (SMD)  
- **Package/Case:** 1206 (3216 Metric)  

### **Descriptions and Features:**  
- Designed for noise suppression in signal lines.  
- High common-mode impedance for effective EMI filtering.  
- Compact SMD design suitable for high-density PCB applications.  
- RoHS compliant.  
- Suitable for high-speed data lines (e.g., USB, HDMI, Ethernet).  

(Note: Always verify with the latest datasheet for updated specifications.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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