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LDB215G5105C-001 from MURATA

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LDB215G5105C-001

Manufacturer: MURATA

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB215G5105C-001,LDB215G5105C001 MURATA 4000 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  

**Part Number:** LDB215G5105C-001  

**Specifications:**  
- **Type:** Inductor  
- **Inductance:** 1.5 µH  
- **Tolerance:** ±20%  
- **Current Rating:** 5.1 A (Saturation Current)  
- **DC Resistance (DCR):** 8.5 mΩ (Typical)  
- **Operating Temperature Range:** -40°C to +125°C  
- **Shielding:** Shielded  
- **Package/Size:** 2520 (Metric: 6.3mm x 5.8mm x 2.8mm)  

**Descriptions and Features:**  
- High-current, shielded power inductor  
- Designed for high-efficiency DC-DC converters  
- Low DCR for reduced power loss  
- Compact and robust construction  
- Suitable for automotive and industrial applications  
- RoHS compliant  

(Note: Always verify with the latest datasheet for accuracy.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB215G5105C-001,LDB215G5105C001 8000 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns The part **LDB215G5105C-001** is a **5.1V, 2A Schottky Barrier Diode (SBD)** manufactured by **ROHM Semiconductor**.  

### **Key Specifications:**  
- **Voltage Rating (VRM):** 5.1V  
- **Average Rectified Current (IO):** 2A  
- **Forward Voltage (VF):** 0.5V (typical at 1A)  
- **Reverse Leakage Current (IR):** 0.1mA (typical at 5.1V)  
- **Operating Temperature Range:** -55°C to +150°C  
- **Package Type:** SOD-123FL (Surface Mount)  

### **Features:**  
- **Low Forward Voltage Drop** for improved efficiency  
- **High Surge Current Capability**  
- **Fast Switching Speed**  
- **Compact and Lightweight** for space-saving designs  

This diode is commonly used in **power supply circuits, reverse polarity protection, and DC-DC converters**.  

Would you like additional details on this part?

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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