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LDB212G4005C-001

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB212G4005C-001,LDB212G4005C001 140052 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns The part **LDB212G4005C-001** is a **4005 MHz Bandpass Filter** from **Lark Engineering**.  

### **Manufacturer Specifications:**  
- **Frequency Range:** 4005 MHz (center frequency)  
- **Bandwidth:** 40 MHz (typical)  
- **Insertion Loss:** ≤ 1.5 dB (typical)  
- **Return Loss:** ≥ 15 dB  
- **Power Handling:** 1W (CW)  
- **Impedance:** 50 Ω  
- **Operating Temperature:** -40°C to +85°C  
- **Package Type:** Surface Mount (SMD)  

### **Descriptions and Features:**  
- Designed for **RF/microwave applications** requiring precise frequency filtering.  
- Provides **high rejection** of out-of-band signals.  
- **Low insertion loss** for minimal signal degradation.  
- **Compact and lightweight**, suitable for space-constrained designs.  
- **RoHS compliant** for environmental safety.  

For exact performance curves and mechanical dimensions, refer to the manufacturer's datasheet.

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB212G4005C-001,LDB212G4005C001 MURATA 8699 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  
**Part Number:** LDB212G4005C-001  

### **Specifications:**  
- **Type:** Noise Suppression Filter (Ferrite Bead)  
- **Impedance:** 50Ω (typical at 100 MHz)  
- **Rated Current:** 500 mA  
- **DC Resistance:** 0.5Ω (max)  
- **Operating Temperature Range:** -40°C to +85°C  
- **Package Size:** 0805 (2.0 mm × 1.25 mm)  

### **Descriptions and Features:**  
- Designed for noise suppression in high-frequency circuits.  
- Suitable for decoupling and EMI filtering in power lines and signal lines.  
- Compact surface-mount design (SMD) for PCB applications.  
- Low DC resistance ensures minimal voltage drop.  
- RoHS compliant.  

(Note: Always verify specifications with the latest datasheet from Murata.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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