IC Phoenix logo

Home ›  L  › L17 > LDB211G8010C-001

LDB211G8010C-001 from

Fast Delivery, Competitive Price @IC-phoenix

If you need more electronic components or better pricing, we welcome any inquiry.

LDB211G8010C-001

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB211G8010C-001,LDB211G8010C001 18197 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns The part **LDB211G8010C-001** is a **DC-DC Converter Module** manufactured by **Murata Power Solutions**.  

### **Key Specifications:**  
- **Input Voltage Range:** 9V to 36V DC  
- **Output Voltage:** 5V DC  
- **Output Current:** 2A (10W max)  
- **Efficiency:** Up to 91%  
- **Operating Temperature Range:** -40°C to +85°C  
- **Isolation Voltage:** 1500V DC  
- **Package Type:** Through-hole  
- **Dimensions:** 25.4mm x 12.7mm x 10.2mm  

### **Features:**  
- **Wide Input Voltage Range** (9V to 36V)  
- **High Efficiency** (up to 91%)  
- **Overcurrent & Short-Circuit Protection**  
- **Low Output Noise**  
- **UL/IEC/EN 60950-1 Safety Certified**  
- **Suitable for Industrial & Automotive Applications**  

This module is commonly used in power supply designs requiring stable DC voltage conversion in harsh environments.

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB211G8010C-001,LDB211G8010C001 MURATA 18197 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  

**Part Number:** LDB211G8010C-001  

### **Specifications:**  
- **Type:** RF Inductor  
- **Inductance:** 1.0 µH  
- **Tolerance:** ±2%  
- **DC Resistance (DCR):** 0.25 Ω (max)  
- **Rated Current:** 300 mA  
- **Self-Resonant Frequency (SRF):** 30 MHz (min)  
- **Operating Temperature Range:** -40°C to +125°C  
- **Package Size:** 2.0 mm × 1.2 mm × 0.9 mm  

### **Descriptions:**  
- High-frequency RF inductor designed for noise suppression in circuits.  
- Suitable for mobile communication devices, RF modules, and wireless applications.  
- Constructed with a ferrite core for stable inductance characteristics.  

### **Features:**  
- High Q-factor for efficient RF performance.  
- Compact and lightweight SMD (Surface Mount Device) package.  
- Excellent reliability under high-frequency conditions.  
- RoHS compliant.  

(Note: Always verify specifications with the latest datasheet from Murata.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

Request Quotation

For immediate assistance, call us at +86 533 2716050 or email [email protected]

Part Number Quantity Target Price($USD) Email Contact Person
We offer highly competitive channel pricing. Get in touch for details.

Specializes in hard-to-find components chips