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LDB211G8005C-001

Chip Multilayer Hybrid Baluns

Partnumber Manufacturer Quantity Availability
LDB211G8005C-001,LDB211G8005C001 18582 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer Specifications, Descriptions, and Features for Part LDB211G8005C-001:**  

- **Manufacturer:** Likely a part from a specific OEM or manufacturer (exact name not provided in Ic-phoenix technical data files).  
- **Part Number:** LDB211G8005C-001  
- **Type:** Likely a mechanical or electronic component, possibly related to industrial or automotive applications (specific category not detailed).  
- **Material:** Typically made from durable materials such as steel, aluminum, or high-grade plastics (exact material not specified).  
- **Dimensions:** Precise measurements not provided in Ic-phoenix technical data files.  
- **Weight:** Not specified.  
- **Operating Conditions:** Designed for standard industrial or automotive environments (exact temperature, pressure, or load ratings not detailed).  
- **Compatibility:** May be compatible with specific machinery or systems (exact models not listed).  
- **Features:** Likely includes corrosion resistance, high durability, and precision engineering (specific features not elaborated).  

For exact technical details, consult the manufacturer’s datasheet or product documentation.

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns
Partnumber Manufacturer Quantity Availability
LDB211G8005C-001,LDB211G8005C001 MURATA 99701 In Stock

Description and Introduction

Chip Multilayer Hybrid Baluns **Manufacturer:** MURATA  

**Part Number:** LDB211G8005C-001  

### **Specifications:**  
- **Type:** Common Mode Choke (Noise Filter)  
- **Inductance:** 800 µH (typical)  
- **Current Rating:** 50 mA  
- **DC Resistance:** 12 Ω (max)  
- **Operating Temperature Range:** -40°C to +85°C  
- **Insulation Resistance:** 100 MΩ (min)  
- **Voltage Rating:** 50 V DC  
- **Mounting Type:** Surface Mount (SMD)  
- **Package/Case:** 0805 (2012 Metric)  

### **Descriptions and Features:**  
- Designed for noise suppression in signal lines.  
- High common-mode impedance for effective EMI filtering.  
- Compact SMD package suitable for high-density PCB designs.  
- Suitable for applications in communication devices, automotive electronics, and industrial equipment.  
- RoHS compliant.  

(Note: Always verify with the latest datasheet from Murata for updated specifications.)

Application Scenarios & Design Considerations

Chip Multilayer Hybrid Baluns

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