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K4T51043QC-ZCCC from SAMSUNG

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K4T51043QC-ZCCC

Manufacturer: SAMSUNG

512Mb C-die DDR2 SDRAM

Partnumber Manufacturer Quantity Availability
K4T51043QC-ZCCC,K4T51043QCZCCC SAMSUNG 594 In Stock

Description and Introduction

512Mb C-die DDR2 SDRAM The part **K4T51043QC-ZCCC** is a memory chip manufactured by **SAMSUNG**. Below are its specifications, descriptions, and features based on available information:  

### **Specifications:**  
- **Manufacturer:** SAMSUNG  
- **Part Number:** K4T51043QC-ZCCC  
- **Type:** DDR2 SDRAM (Synchronous DRAM)  
- **Density:** 512Mb (Megabit)  
- **Organization:** 64M x 8 (64 Meg words x 8 bits)  
- **Speed Grade:** ZCCC (specific timing and frequency, exact speed may vary)  
- **Voltage:** 1.8V (standard for DDR2)  
- **Package:** FBGA (Fine-pitch Ball Grid Array)  
- **Operating Temperature:** Commercial (0°C to 70°C) or Industrial (-40°C to 85°C) depending on variant  

### **Descriptions & Features:**  
- **DDR2 Technology:** Offers higher bandwidth and lower power consumption compared to DDR1.  
- **Synchronous Operation:** Clock-synchronized for efficient data transfer.  
- **On-Die Termination (ODT):** Improves signal integrity.  
- **Low Power Consumption:** 1.8V operation reduces power usage.  
- **FBGA Packaging:** Compact and suitable for high-density applications.  
- **Applications:** Used in computing, networking, and embedded systems requiring DDR2 memory.  

This part is typically found in systems requiring **512Mb DDR2 memory** with an 8-bit configuration. For exact speed ratings, refer to the datasheet for the **ZCCC speed bin**.  

Would you like additional details on a specific aspect?

Partnumber Manufacturer Quantity Availability
K4T51043QC-ZCCC,K4T51043QCZCCC SEC 300 In Stock

Description and Introduction

512Mb C-die DDR2 SDRAM The part **K4T51043QC-ZCCC** is a memory module manufactured by **SEC (Samsung Electronics)**.  

### **Specifications:**  
- **Type:** DDR2 SDRAM  
- **Density:** 512Mb  
- **Organization:** 64M x 8  
- **Speed:** 400MHz (PC2-3200)  
- **Voltage:** 1.8V  
- **Package:** FBGA (Fine-pitch Ball Grid Array)  
- **Operating Temperature:** Commercial (0°C to 85°C)  

### **Descriptions & Features:**  
- Low power consumption  
- High-speed data transfer  
- On-die termination (ODT) support  
- Programmable CAS latency (3, 4, 5)  
- Burst lengths: 4, 8  
- Auto refresh and self-refresh modes  
- RoHS compliant  

This module is commonly used in computing and embedded systems requiring DDR2 memory.

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