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K4S510432B-TC75 from SAMSUNG

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K4S510432B-TC75

Manufacturer: SAMSUNG

512Mb B-die SDRAM Specification

Partnumber Manufacturer Quantity Availability
K4S510432B-TC75,K4S510432BTC75 SAMSUNG 185 In Stock

Description and Introduction

512Mb B-die SDRAM Specification The **K4S510432B-TC75** is a memory chip manufactured by **SAMSUNG**. Below are its specifications, descriptions, and features based on factual information from Ic-phoenix technical data files:  

### **Specifications:**  
- **Memory Type:** Synchronous DRAM (SDRAM)  
- **Organization:** 512K words × 32 bits × 4 banks  
- **Density:** 64Mbit (4M × 16)  
- **Voltage:** 3.3V (±0.3V)  
- **Speed:** 7.5ns (133MHz @ CL=2)  
- **Package:** 54-pin TSOP II  
- **Operating Temperature:** Commercial (0°C to 70°C)  
- **Refresh:** 4096 cycles / 64ms  

### **Descriptions & Features:**  
- **High-Speed Operation:** Supports clock frequencies up to **133MHz** with a **7.5ns access time**.  
- **Burst Mode:** Supports **sequential and interleaved burst modes** for efficient data transfer.  
- **Auto Refresh & Self Refresh:** Includes **CAS-before-RAS (CBR) refresh** and **self-refresh** for power-saving modes.  
- **Programmable Burst Length:** Supports **1, 2, 4, 8, or full-page** burst operations.  
- **Low Power Consumption:** Operates at **3.3V** with power-down and standby modes.  
- **Four-Bank Architecture:** Enables high-performance memory access with reduced latency.  
- **Compatibility:** Designed for use in **PC100/PC133** SDRAM applications.  

This chip is commonly used in **PC memory modules, embedded systems, and networking devices**.  

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