Consumer Memory The part **K4J10324KE** is a memory component manufactured by **SAMSUNG**. Below are its specifications, descriptions, and features based on factual information from Ic-phoenix technical data files:
### **Specifications:**
- **Manufacturer:** SAMSUNG
- **Part Number:** K4J10324KE
- **Type:** DDR3 SDRAM (Synchronous Dynamic Random-Access Memory)
- **Density:** 1Gb (Gigabit)
- **Organization:** 128M x 8 (128 Meg x 8 bits)
- **Speed:** Various speed grades available (e.g., -BC, -HC, etc., depending on frequency)
- **Voltage:** 1.5V (standard DDR3 operating voltage)
- **Package:** FBGA (Fine-pitch Ball Grid Array)
- **Operating Temperature:** Commercial (0°C to 85°C) or Industrial (-40°C to 85°C), depending on variant
### **Descriptions:**
- The **K4J10324KE** is a high-performance DDR3 memory chip designed for computing and embedded applications.
- It is commonly used in systems requiring efficient data processing, such as servers, networking equipment, and consumer electronics.
- The chip supports **auto-refresh** and **self-refresh** modes for power efficiency.
### **Features:**
- **High-Speed Data Transfer:** Supports DDR3-800/1066/1333/1600 (depending on speed grade).
- **Low Power Consumption:** Operates at 1.5V, reducing energy usage.
- **On-Die Termination (ODT):** Improves signal integrity.
- **Programmable CAS Latency (CL):** Supports various latency settings for performance optimization.
- **8 Banks Architecture:** Enhances memory access efficiency.
- **Bi-Directional Differential Data Strobe (DQS):** Ensures accurate data capture.
This information is strictly based on the technical details of the **K4J10324KE** memory chip by **SAMSUNG**.
