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IDT72V2101L15PF from IDT

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IDT72V2101L15PF

Manufacturer: IDT

3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO

Partnumber Manufacturer Quantity Availability
IDT72V2101L15PF IDT 33 In Stock

Description and Introduction

3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO The **IDT72V2101L15PF** is a high-speed, low-power synchronous FIFO (First-In, First-Out) memory device manufactured by **Integrated Device Technology (IDT)**. Below are its key specifications, descriptions, and features:

### **Specifications:**
- **Part Number:** IDT72V2101L15PF  
- **Memory Size:** 64K x 18 bits (1,179,648 bits)  
- **Organization:** 65,536 words × 18 bits  
- **Speed Grade:** 15 ns (access time)  
- **Operating Voltage:** 3.3V  
- **Operating Temperature Range:** Commercial (0°C to +70°C)  
- **Package Type:** 80-pin Plastic Thin Quad Flat Pack (TQFP)  
- **I/O Type:** Synchronous, bidirectional  
- **Clock Frequency:** Up to 66 MHz  
- **Power Consumption:** Low-power CMOS technology  

### **Descriptions:**
- The **IDT72V2101L15PF** is a synchronous FIFO designed for high-speed data buffering applications.  
- It supports **First-Word Fall-Through (FWFT)** mode, allowing the first word to appear on the output before a read operation.  
- Features **programmable Almost Full/Almost Empty flags** for flow control.  
- Includes **retransmit capability**, enabling data to be reread from the beginning of the FIFO.  
- Suitable for applications requiring high-speed data transfer, such as networking, telecommunications, and digital signal processing.  

### **Features:**
- **High-Speed Operation:** 15 ns access time, 66 MHz clock frequency.  
- **Low Power Consumption:** 3.3V operation with CMOS technology.  
- **Bidirectional Data Flow:** Supports simultaneous read and write operations.  
- **Programmable Flags:** Almost Full (AF) and Almost Empty (AE) for efficient data management.  
- **First-Word Fall-Through (FWFT) Mode:** Enhances performance by reducing latency.  
- **Retransmit Function:** Allows re-reading of stored data.  
- **Industrial-Grade Packaging:** 80-pin TQFP for compact PCB integration.  

This FIFO is commonly used in applications like **data acquisition, buffering between processors, and high-speed communication systems**.  

Would you like additional details on pin configurations or timing diagrams?

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