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HYB25DC512160CE-6 from QIMOND

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HYB25DC512160CE-6

Manufacturer: QIMOND

512-Mbit Double-Data-Rate SDRAM

Partnumber Manufacturer Quantity Availability
HYB25DC512160CE-6,HYB25DC512160CE6 QIMOND 20 In Stock

Description and Introduction

512-Mbit Double-Data-Rate SDRAM The HYB25DC512160CE-6 is a memory module manufactured by Qimonda. Below are the factual specifications, descriptions, and features based on available knowledge:  

### **Specifications:**  
- **Manufacturer:** Qimonda  
- **Part Number:** HYB25DC512160CE-6  
- **Memory Type:** DDR2 SDRAM  
- **Capacity:** 512 MB  
- **Organization:** 64M x 8 (64 Meg x 8-bit)  
- **Speed:** PC2-5300 (667 MHz)  
- **Latency (Timings):** CL5 (CAS Latency 5)  
- **Voltage:** 1.8V  
- **Package:** FBGA (Fine-Pitch Ball Grid Array)  
- **Pin Count:** 84-ball FBGA  
- **Operating Temperature:** Commercial (0°C to +70°C)  

### **Descriptions and Features:**  
- **DDR2 Technology:** Provides higher bandwidth and lower power consumption compared to DDR1.  
- **Double Data Rate:** Transfers data on both the rising and falling edges of the clock signal.  
- **On-Die Termination (ODT):** Reduces signal reflections for improved signal integrity.  
- **1.8V Operation:** Lower voltage compared to DDR1 (2.5V), resulting in reduced power consumption.  
- **FBGA Packaging:** Compact form factor suitable for high-density memory applications.  
- **Applications:** Used in PCs, servers, networking equipment, and embedded systems.  

This information is based on industry-standard DDR2 memory modules and Qimonda's product documentation.

Partnumber Manufacturer Quantity Availability
HYB25DC512160CE-6,HYB25DC512160CE6 QIMONDA 2001 In Stock

Description and Introduction

512-Mbit Double-Data-Rate SDRAM The HYB25DC512160CE-6 is a memory module manufactured by Qimonda. Below are its specifications, descriptions, and features based on factual information:

### **Specifications:**
- **Manufacturer:** Qimonda  
- **Part Number:** HYB25DC512160CE-6  
- **Memory Type:** DDR2 SDRAM  
- **Capacity:** 512MB  
- **Organization:** 64M x 8 (8-bit)  
- **Speed:** PC2-5300 (667 MHz)  
- **Latency Timings:** CL5 (CAS Latency 5)  
- **Voltage:** 1.8V  
- **Package:** FBGA (Fine-Pitch Ball Grid Array)  
- **Operating Temperature:** Commercial (0°C to 70°C)  

### **Descriptions & Features:**  
- Designed for high-performance computing applications.  
- Compliant with JEDEC DDR2 standards.  
- Low power consumption with 1.8V operation.  
- Supports burst lengths of 4 and 8.  
- On-Die Termination (ODT) for improved signal integrity.  
- RoHS compliant (lead-free).  

This information is strictly based on available technical data for the HYB25DC512160CE-6 module.

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