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HY5S5B2CLFP-HE from HYNIX

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HY5S5B2CLFP-HE

Manufacturer: HYNIX

256M (8Mx32bit) Mobile SDRAM

Partnumber Manufacturer Quantity Availability
HY5S5B2CLFP-HE,HY5S5B2CLFPHE HYNIX 1383 In Stock

Description and Introduction

256M (8Mx32bit) Mobile SDRAM The part **HY5S5B2CLFP-HE** is a **512Mb (32Mx16) DDR SDRAM** manufactured by **Hynix**. Here are its key specifications:

- **Type**: DDR SDRAM (Double Data Rate Synchronous DRAM)
- **Density**: 512Mb (Megabits)
- **Organization**: 32Mx16 (32 Meg words × 16 bits)
- **Voltage**: 2.5V ±0.2V
- **Package**: 60-ball FBGA (Fine-pitch Ball Grid Array)
- **Speed**: PC2100 (DDR266) with clock frequency of **133MHz**
- **Data Rate**: 266Mbps/pin
- **Burst Length**: 2, 4, or 8
- **CAS Latency (CL)**: 2, 2.5
- **Operating Temperature**: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C), depending on variant
- **Refresh**: 4096 refresh cycles / 64ms
- **Interface**: SSTL_2 (Stub Series Terminated Logic for 2.5V)

This DRAM is designed for high-speed data transfer in applications such as networking, computing, and embedded systems.

Application Scenarios & Design Considerations

256M (8Mx32bit) Mobile SDRAM

Alternative Part Number

  • K4B2G1646F-BYK0 --: Samsung 2Gb DDR3 SDRAM in the same density and speed class, widely available and pin-compatible for most Hynix DDR3 designs.
  • MT41J128M16HA-125 --: Micron 2Gb DDR3 component with comparable organization and speed grade, a common drop-in alternative for Hynix DDR3 memory.
  • W631GG6KB-12 --: Winbond 1Gb/2Gb-class DDR3 SDRAM offering similar interface and timing, suitable as a secondary sourcing option.

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