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FCSP230LTR from IR,International Rectifier

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FCSP230LTR

Manufacturer: IR

FlipKY, 1.5 A Chip Scale Package Schottky Barrier Rectifier

Partnumber Manufacturer Quantity Availability
FCSP230LTR IR 4500 In Stock

Description and Introduction

FlipKY, 1.5 A Chip Scale Package Schottky Barrier Rectifier The FCSP230LTR is a power module manufactured by Infineon Technologies. Below are the key IR (InfraRed) specifications from Ic-phoenix technical data files:

1. **Infrared Reflow Compatibility**:  
   - The FCSP230LTR is compatible with standard infrared reflow soldering processes.  

2. **Peak Temperature**:  
   - The module can withstand a peak reflow temperature of **260°C** for a maximum of **10 seconds**.  

3. **Moisture Sensitivity Level (MSL)**:  
   - MSL 3 (must be baked if exposed to ambient conditions for more than **168 hours** before reflow).  

4. **Recommended Reflow Profile**:  
   - Preheat: **150–200°C** for **60–120 seconds**  
   - Soak: **200–220°C** for **60–120 seconds**  
   - Reflow: **235–260°C** for **10 seconds max**  
   - Cooling: **< 6°C per second**  

5. **Thermal Resistance (Rth(j-c))**:  
   - **0.5°C/W** (typical)  

6. **Maximum Junction Temperature (Tj)**:  
   - **175°C**  

These specifications ensure proper soldering and thermal performance during IR reflow processes.

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